VTC200PV Vacuumable and Atmosphere-Controlled Spin Coater for 6″ Wafers with 10,000 RPM Max Speed
The VTC200PV spin coater is engineered for laboratory applications requiring controlled atmosphere spin coating processes. It enables coating under vacuum or inert gas environments, essential for sensitive materials and processes that demand minimal contamination or oxidation. The system supports substrates up to 6 inches in diameter, making it suitable for semiconductor wafers and similar flat samples.
This spin coater features a polypropylene (PP) construction for both the case and spin disk, providing resistance against corrosive coating solutions. The digital control box is physically separated from the spin coater unit, allowing remote operation and enhanced safety. The device offers a wide adjustable spin speed range from 500 to 10,000 revolutions per minute (RPM), programmable in up to six segments with customizable durations up to 999 seconds each.
Key Features
- Polypropylene construction resists corrosive chemicals during coating.
- Vacuum and inert gas atmosphere control for versatile coating environments.
- Supports wafers up to 6 inches diameter with mechanical or vacuum chuck fixtures.
- Two-stage rotary vane vacuum pump included for chamber vacuum down to 110 torr.
- Digital vacuum gauge mounted on the spin coater top cover for real-time monitoring.
- Separated digital control box with six programmable spin segments and variable speed control.
- Includes 20 ml syringe for precise liquid coating material injection.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | VTC200PV |
| Spin Speed Range | 500 – 10,000 RPM, adjustable |
| Spin Segments | Up to 6 programmable segments, max 999 seconds each |
| Substrate Size | Up to 6 inches diameter |
| Chamber Diameter | 150 mm |
| Material | Polypropylene (PP) case and spin disk |
| Vacuum Pump | Two-stage rotary vane pump, 156 L/min, with exhaust filter |
| Maximum Vacuum Level | 110 torr |
| Motor | 24 VDC brushless, 200 W max |
| Power Supply | 220 VAC, 50/60 Hz, single phase, 1000 W max (110 V optional with transformer) |
| Liquid Injection | 20 ml syringe included |
| Control Box | Separated digital control box with power outlet for vacuum pump |
| Vacuum Chuck | PP anti-corrosive vacuum chuck for inert gas atmosphere only |
| Mechanical Chuck | Used for vacuum injection coating |
| Certifications | CE certified; NRTL or CSA optional |
Typical Applications
The VTC200PV is ideal for spin coating processes requiring controlled atmospheres such as vacuum or inert gas environments. It is commonly used in semiconductor wafer coating, thin film deposition research, and applications involving corrosive or sensitive coating materials. The ability to program multiple spin segments with variable speeds supports complex coating recipes and uniform film formation.
Configuration and Operating Notes
The standard package includes the spin coater unit, separated digital control box, two-stage vacuum pump with exhaust filter, digital vacuum gauge, and a 20 ml syringe for coating material injection. The vacuum chuck is suitable only for use under inert gas atmospheres, while the mechanical chuck must be used for vacuum injection processes. Users should avoid overflushing the water bowl/base to prevent liquid damage to the motor shaft. Cleaning instructions should be followed carefully to maintain equipment longevity.
Dimensions & Shipping
| Shipping dimensions | 40″(L) x 30″(W) x 30″(H) |
|---|
