VTC-600-3HD-LD DC/RF 3-Head High Vacuum 2-Inch Magnetron Plasma Sputtering Coater with Multi-Target Co-Sputtering and Heating Stage
The VTC-600-3HD-LD is engineered for precise thin-film deposition tasks requiring simultaneous or sequential sputtering of multiple materials. It is particularly suited for fabricating complex ternary compositions and multilayer films used in applications such as lithium-ion battery electrodes, ferroelectric layers, and optical coatings. This system enables controlled co-sputtering from up to three distinct targets, facilitating compositional gradients across substrates.
The coater integrates three 2-inch magnetron sputtering heads, two powered by DC sources optimized for metallic targets, and one by an RF source designed for non-conductive materials. The stainless steel vacuum chamber with a 300 mm diameter and 300 mm height provides a high vacuum environment, accessible via a hinged top flange and a 100 mm glass viewport. The sample stage supports rotation speeds from 1 to 20 rpm and heating up to 500°C, controlled by a programmable temperature controller to ensure uniform film deposition.
Key Features
- Three 2-inch magnetron sputtering heads with water cooling and shutters for precise target control.
- Two 500 W DC power supplies for metallic target sputtering and one 300 W RF power supply at 13.56 MHz for insulating materials.
- Rotating and heating sample stage (Ø140 mm) with temperature up to 500°C and rotation speed adjustable between 1-20 rpm.
- Stainless steel vacuum chamber (Ø300 × 300 mm) with hinged top flange and glass viewport for easy sample access and observation.
- Three mass flow controllers calibrated for nitrogen gas with flow rates up to 200 sccm for precise process gas control.
- Optional accessories include turbomolecular and backing pumps for achieving base pressures below 1e-2 torr, water chillers for cooling, and quartz crystal microbalance for in-situ film thickness monitoring.
- CE approved with optional NRTL certification available upon request.
Technical Specifications
| Parameter | Specification |
|---|---|
| Power Supply | 208-240 VAC, single phase, 50/60 Hz, 1500 W |
| Sputtering Power Sources | Two DC sources (500 W each), One RF source (300 W, 13.56 MHz) |
| Magnetron Heads | Three 2″ diameter with water cooling jackets and shutters |
| Target Size | 2″ diameter, thickness 0.1 – 5 mm (optional targets) |
| Vacuum Chamber | Stainless steel, Ø300 × 300 mm H, 100 mm glass viewport, hinged top flange |
| Sample Stage | Ø140 mm rotating and heating stage, 1-20 rpm, up to 500°C, programmable controller |
| Gas Flow Control | Three mass flow controllers, 0–200 sccm, nitrogen calibrated |
| Optional Vacuum Pumps | 63 or 260 L/s turbomolecular pump, 240 L/min rotary vane or 200 L/min dry scroll backing pump |
| Optional Water Chiller | Digital temperature-controlled recirculating chiller, 5–35 °C, 16 L/min flow, 14 psi pump pressure |
| Optional Film Thickness Measurement | Quartz crystal microbalance, accuracy up to 1 Å |
Typical Applications
This sputtering coater is ideal for research and development of thin films in battery materials, including ternary and multilayer coatings for lithium-ion rechargeable batteries. It is also suitable for depositing ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard coatings, and PTFE films. The system supports both conductive and insulating target materials, enabling versatile thin-film fabrication.
Configuration & Operating Notes
Optional configurations include additional sputtering heads, extended RF cables, and vacuum pump stations for enhanced base pressure and air-sensitive target handling. A water chiller is recommended to maintain cooling of the magnetron heads. The system can be adapted for integration into gloveboxes for controlled atmosphere processing. Proper safety measures should be observed when operating under high vacuum and elevated temperatures.
