HVMSS-SPC-2F 2-Inch High Vacuum Magnetron Sputter Source with Adjustable Tilt and Quick Connector
The HVMSS-SPC-2F is engineered for precise thin film deposition in high vacuum environments, accommodating a broad range of sputtering targets including metallic, insulating, magnetic, and non-magnetic materials. Its 2-inch diameter circular magnetron design incorporates a rare-earth NdFeB permanent magnet assembly, which ensures excellent film uniformity and maximizes target utilization efficiency.
This sputter source features a sputtering head capable of tilting ±25 degrees, allowing users to adjust the incidence angle of ion bombardment to optimize sputtering yield. Constructed from high-quality stainless steel and ceramics, the device is robust and designed for long-term durability. Installation is straightforward, facilitated by a high vacuum quick connector compatible with vacuum chambers having a 1-inch diameter through-hole.
Key Features
- 2-inch diameter circular magnetron with NdFeB rare-earth permanent magnet for uniform magnetic field and film deposition.
- Sputtering head tilt adjustable ±25° to enhance sputtering yield by optimizing bombardment angle.
- Compatible with both DC (max 500 W) and RF (max 300 W) power supplies; supports sputtering currents up to 5 A.
- Includes a 2-inch copper backing plate (EQ-CBP-2) and a high vacuum quick connector for easy installation.
- Constructed with corrosion-resistant coatings on magnets and high-quality stainless steel and ceramic materials.
- Supports sputtering target thicknesses up to 1/4 inch for non-magnetic and 1/16 inch for magnetic targets without height adjustment.
- Cooling water system requires filtered flow at 0.8 GPM with inlet temperature below 20°C; uses 6 mm quick disconnect tubing.
Technical Specifications
| Parameter | Specification |
|---|---|
| Sputtering Target Diameter | 2.0 inch (50.8 mm) |
| Target Thickness | Up to 1/4 inch (non-magnetic), up to 1/16 inch (magnetic) |
| Magnet Type | NdFeB Rare Earth Permanent Magnet |
| Sputtering Current (Max.) | 5 Amp |
| Sputtering Voltage Range | 200 – 1000 V |
| Sputtering Pressure Range | 1 – 1000 mTorr |
| Power Supply Compatibility | DC up to 500 W, RF up to 300 W |
| Cooling Water Flow Rate | 0.8 GPM (filtered) |
| Cooling Water Inlet Temperature | Below 20°C |
| Water Tubing | 6 mm quick disconnect |
| Mounting Feedthrough | 3/4 inch O.D. tube |
| Anode Shield Diameter | 86 mm |
| Electrical Connector | Standard SL16 cable connector; optional 148 cm RF cable with SL6 connector |
Typical Applications
This sputter source is ideal for depositing thin films in research and industrial settings requiring high uniformity and target utilization. It supports a wide variety of materials, making it suitable for semiconductor fabrication, magnetic thin films, optical coatings, and insulating layers.
Configuration & Operating Notes
The package includes the HVMSS-SPC-2F sputter source, a 2-inch copper backing plate (EQ-CBP-2), and a high vacuum quick connector (EQ-FT-QC) for easy mounting. Optional accessories include a 6-inch CF flange with vacuum feedthrough for alternative mounting and a digital temperature-controlled water chiller to maintain cooling requirements. Target replacement is straightforward without the need for height adjustment. Proper filtered cooling water flow and temperature control are essential to ensure stable operation and magnet longevity.
Dimensions & Shipping
| Product dimensions | Anode Shield Diameter: 86mm |
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