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VTC-300SS-4 Four Nozzles Spin-Spray Coater for Multi-Layer Coating on Up to 12″ Substrates with Selectable Ultrasonic and Gas-Driven Spray Heads

Designed for uniform multi-layer liquid-phase coatings on large substrates up to 12" diameter.
Combines spin coating with four spray nozzles for precise sequential deposition.
Spin speed adjustable from 300 to 3000 rpm, with vacuum chuck for substrate holding.
Includes four programmable peristaltic pumps and selectable spray heads: compressive gas or ultrasonic (40kHz/120kHz).

Compliance: CE Certified
Customized: OEM/ODM
Package: Plywood case package

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VTC-300SS-4 Four Nozzles Spin-Spray Coater for Multi-Layer Coating on Up to 12″ Substrates

The VTC-300SS-4 is engineered to address the challenge of applying dense, uniform liquid-phase coatings on large, flat substrates up to 12 inches in diameter or 8 inches square. It integrates spin coating with spray deposition, enabling precise multi-layer coatings through four independently controlled spray nozzles. This combination is particularly suitable for applications requiring sequential layering of different solutions without cross-contamination.

The system’s vacuum chuck securely holds substrates during processing, while the spin speed is adjustable from 300 to 3000 rpm, with a recommended limit of 2000 rpm for wafers larger than 8 inches to ensure safety and stability. The four spray nozzles can be selected from three types: standard compressive gas-driven nozzles included as standard, or optional ultrasonic spray heads operating at 40 kHz or 120 kHz frequencies. Higher ultrasonic frequencies produce finer atomization and thinner coatings, though at increased cost.

Key Features

  • Four spray nozzles enable programmable multi-layer coating sequences via touchscreen control.
  • Vacuum chuck with adjustable holders accommodates flat substrates up to 12″ diameter or 8″ square.
  • Spin speed adjustable from 300 to 3000 rpm; safety recommended max 2000 rpm for larger wafers.
  • Three spray head options: compressive gas-driven (standard), 40 kHz ultrasonic, or 120 kHz ultrasonic (optional).
  • Four peristaltic pumps with programmable flow rates (0.05–380 ml/min) and solenoid valves prevent cross-contamination.
  • Optional heatable top cover with halogen lamp and digital temperature controller (+/-1ºC accuracy) up to 100ºC.
  • Touchscreen panel for setting spin speed, injection sequence, timing, and cycle count.

Technical Specifications

Parameter Specification
Maximum Substrate Size 12″ diameter or 8″ square
Spin Speed Range 300 – 3000 rpm (recommended max 2000 rpm for >8″ wafers)
Spray Nozzle Types Four compressive gas-driven (standard), optional 40 kHz or 120 kHz ultrasonic heads
Peristaltic Pumps Four pumps, programmable flow 0.05 – 380 ml/min with solenoid valves
Vacuum Chuck Oil-less pump included, adjustable substrate holders
Heating Cover (Optional) Ring-type halogen lamp, digital controller, max 100ºC ±1ºC
Power Supply 208 – 240 VAC, 50/60 Hz, 3000 W total

Typical Applications

The VTC-300SS-4 is well suited for coating processes requiring precise multi-layer deposition on large substrates, including polymer coatings, composite and powder material coatings, and low-temperature precipitation such as RF/microwave ferrite films. It is also effective for coating patterned or uneven surfaces where uniform coverage is critical.

Configuration & Operating Notes

The system includes four compressive gas-driven spray nozzles as standard. Ultrasonic spray heads at 40 kHz or 120 kHz frequencies are available optionally to achieve finer atomization and thinner coatings. The four peristaltic pumps allow sequential injection of different solutions with programmable flow rates and timing, controlled via the touchscreen panel. Solenoid valves prevent cross-contamination by ensuring only one solution is injected at a time.

For safety and optimal coating quality, operation within a fume hood with proper exhaust is recommended. Users should experiment with parameters such as solution viscosity, spin speed, substrate heating, and spray settings to optimize film uniformity. Avoid overflushing the water bowl to prevent damage, and clean substrates prior to coating using plasma cleaning to reduce surface tension and improve adhesion.

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