UNIPOL1202 12″ Precision Auto Lapping and Polishing Machine with Dual 4″ Workstations and Touchscreen Control
The UNIPOL1202 is engineered to meet the demanding requirements of polishing and lapping crystal components, semiconductor wafers, and ceramic substrates with diameters up to 4 inches. It is particularly suited for applications requiring ultra-flat surfaces and precise material removal, such as semiconductor device fabrication and advanced materials research. This machine also supports metallographic sample preparation through its adaptable polishing capabilities.
Equipped with two 12-inch diameter super-flat lapping plates, the UNIPOL1202 enables simultaneous processing of two wafers via independent rocking workstations. One plate is cast iron designed for lapping, while the other is aluminum for polishing pad attachment. The system is controlled through an intuitive touchscreen panel, allowing precise adjustment of rotational speed, rocking frequency, and operation time to optimize polishing results.
Key Features
- Two 12″ diameter lapping plates with flatness better than 0.25 micron per square inch
- Dual 8° rocking workstations with independent control for processing two 4″ wafers simultaneously
- Variable master plate speed adjustable from 0 to 125 rpm with digital display
- Adjustable rocking speed from 0 to 9 rocking motions per minute
- Programmable timer with auto-stop function up to 99 hours
- 300 W high torque DC motor for stable and precise operation
- Complete standard accessories including wafer holders, conditioning rings, polishing pads, and tools for immediate use
Technical Specifications
| Parameter | Specification |
|---|---|
| Power Supply | AC 208-240V, 50/60Hz (110V version optional with transformer) |
| Motor | 300 W high torque DC motor (24VDC motor optional for glovebox operation) |
| Lapping Plates | Two 12″ diameter plates: cast iron (lapping) and aluminum (polishing pad holder) |
| Plate Flatness | Less than 0.25 micron per square inch |
| Workstations | Two rocking stations with 8° rocking angle, adjustable speed 0-9 rpm |
| Sample Holders | Two flat holders, 105 mm diameter x 35 mm thickness, each holding up to two 4″ wafers |
| Condition Rings | Two rings, 120 mm outer diameter x 110 mm inner diameter x 32 mm thickness |
| Rotational Speed | 0 to 125 rpm with digital display |
| Timer | Adjustable 0 to 99 hours with auto-stop |
| Precision Run-off | Less than 5 microns |
| Case Material | Heavy duty cast aluminum with bright black or white paint |
Typical Applications
Ideal for polishing and lapping semiconductor wafers, crystal components, and ceramic substrates requiring high surface flatness and finish quality. Also suitable for metallographic sample preparation in materials science laboratories.
Configuration and Operating Notes
The standard package includes all necessary accessories such as polishing pads, conditioning rings, sample holders, wax, power cord, and tools for immediate operation. Optional accessories include an automatic slurry feeder with a 1-gallon capacity container for extended polishing sessions and multi-sample polishing fixtures for batch processing smaller samples.
A 24VDC motor option is available for operation inside inert gas gloveboxes. Users should ensure proper maintenance and storage to avoid rust and damage, as these are not covered under warranty.
Dimensions & Shipping
| Product dimensions | of shipment; 40″ x 30″ x 26″ |
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