UNIPOL-2001 Precision Grinding and Polishing Machine with Three Independent Workstations for Large Samples up to 8 Inches
The UNIPOL-2001 is engineered to meet the demands of precision surface finishing for large-size samples, including wafers up to 160 mm in diameter or rectangular samples with a diagonal length up to 160 mm. It is ideal for preparing materials such as crystals, ceramics, metals, glass, rocks, minerals, PCB plates, and infrared optical materials like zinc selenide, zinc sulfide, silicon, and germanium. This machine supports both grinding and polishing processes, ensuring high-quality surface finishes for a wide range of applications.
The machine incorporates a 508 mm (20-inch) diameter grinding plate made of cast iron for lapping and a cast aluminum polishing plate. It operates within a speed range of 20 to 90 RPM. Three rocking workstations are positioned equidistantly around the grinding plate, each equipped with wafer holders and conditioning rings that can be controlled independently. This configuration allows simultaneous processing of three wafers sized between 6 and 8 inches. The standard package includes three flat sample holders and conditioning rings for 6-inch wafers, with optional holders available for 8-inch wafers.
Key Features
- Three independent rocking workstations enable simultaneous polishing of multiple samples.
- Large 20-inch diameter grinding and polishing plates accommodate sizable samples.
- Speed adjustable from 20 to 90 RPM for precise control over grinding and polishing processes.
- Supports a wide variety of materials including crystals, ceramics, metals, glass, and infrared optical materials.
- Sample holders and conditioning rings included for 6-inch wafers; 8-inch holders available optionally.
- Robust construction with cast iron and cast aluminum plates for durability and consistent performance.
- Operates on single-phase AC 220V power supply with 1.7 kW power consumption.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | UNIPOL-2001 |
| Grinding Plate Diameter | 508 mm (20 inches) |
| Grinding Plate Material | Cast iron (lapping), Cast aluminum (polishing) |
| Grinding Plate Speed | 20-90 RPM |
| Number of Workstations | Three independent rocking stations |
| Sample Size Capacity | Up to Ø160 mm wafers or rectangular samples with diagonal ≤160 mm |
| Sample Plate Diameter | 160 mm |
| Sample Plate Thickness | 35 mm |
| Conditioning Ring Dimensions (OD x ID x Thickness) | Ø196 mm x Ø160.5 mm x 35 mm |
| Power Supply | AC 220V, single phase, 50/60 Hz |
| Power Consumption | 1.7 kW |
| Environmental Conditions | Altitude ≤1000 m; Temperature 25°C ±15°C; Humidity 55% RH ±10% |
Typical Applications
The UNIPOL-2001 is suitable for precision surface preparation in research and production environments involving crystals, ceramics, metals, glass, rocks, minerals, and advanced materials such as infrared optical substrates. It is also applicable for PCB plate polishing and refractory materials processing.
Configuration and Operating Notes
The machine includes three flat sample holders and conditioning rings for 6-inch wafers as standard. Holders and rings for 8-inch wafers can be provided upon request. Optional slurry feeders are available to enhance polishing efficiency and consistency. Proper environmental conditions should be maintained to ensure optimal performance and longevity. Users should follow recommended maintenance practices to avoid rusting or damage not covered by warranty.
Dimensions & Shipping
| Product dimensions | 1180 L x 820 W x 945 H (mm) |
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