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DC/RF 4-Head 2-Inch High Vacuum Magnetron Plasma Sputtering Coater System for Thin Film Deposition with Modular Design and Flexible Power Configuration

Designed for precise single-layer thin film deposition in research and development.
Supports up to four 2-inch magnetron sputtering heads with water cooling and shutters.
Flexible DC and RF power supplies enable coating of conductive and non-conductive materials.
Compact vacuum chamber with rotating and heating sample stage up to 500°C.

규정 준수: CE 인증 획득
맞춤형: OEM/ODM
포장: 합판 케이스 포장

제품

DC/RF 4-Head 2-Inch High Vacuum Magnetron Plasma Sputtering Coater System for Thin Film Deposition

This magnetron sputtering coater system is engineered for laboratory-scale deposition of single-layer thin films, addressing the needs of advanced material research such as solid-state electrolytes and OLEDs. The system accommodates up to four sputtering heads, each designed for 2-inch diameter targets, enabling versatile coating processes on various substrates.

The system features a modular architecture separating the vacuum chamber, pumping unit, and power supplies, allowing users to customize configurations according to specific experimental requirements. The vacuum chamber is semicircular stainless steel with a 300 mm diameter and a hinged top flange for convenient sample access. It achieves an ultimate vacuum level of 3.0 × 10⁻⁵ Pa, suitable for high-quality thin film deposition.

주요 기능

  • Four 2-inch magnetron sputtering heads equipped with water cooling jackets and shutters for precise process control.
  • Flexible power supply options: DC source (500 W) for conductive materials and RF source (300 W, 13.56 MHz) for non-conductive materials.
  • Rotating and heating sample stage (Ø140 mm) capable of temperatures up to 500°C and rotation speeds from 1 to 20 rpm.
  • Two mass flow controllers calibrated for nitrogen gas with flow rates up to 200 sccm for controlled gas environment.
  • Optional vacuum pump stations including turbomolecular and backing pumps for enhanced base pressure and air-sensitive target handling.
  • Optional digital temperature-controlled water chiller recommended for cooling requirements, with a refrigeration range of 5 to 35 °C.
  • Optional quartz crystal microbalance available for in-situ film thickness monitoring with accuracy up to 1 Å.

기술 사양

매개변수 사양
Power Requirements 208–240 VAC, Single Phase, 50/60 Hz
Total Power Consumption < 3.5 kW
DC Power Source 500 W for metallic/conductive materials
RF Power Source 300 W, 13.56 MHz for non-conductive materials
Magnetron Sputtering Heads Four 2″ heads with water cooling jackets and shutters; target size 2″ diameter, thickness 0.1–5 mm
Vacuum Chamber Stainless steel semicircular, Ø300 mm; hinged top flange; ultimate vacuum 3.0 × 10⁻⁵ Pa (2.25 × 10⁻⁷ Torr)
Sample Stage Ø140 mm rotating and heating stage; temperature up to 500°C; rotation speed 1–20 rpm
Gas Flow Control Two mass flow controllers; nitrogen calibrated; flow rate 0–200 sccm; 1/4″ vent port
Optional Vacuum Pumps 63 or 260 L/s turbomolecular pump; 240 L/min rotary vane or 200 L/min dry scroll backing pump
Optional Water Chiller Digital temperature control; refrigeration 5–35 °C; flow rate 16 L/min; pump pressure 14 psi
Optional Film Thickness Measurement Quartz crystal microbalance with accuracy up to 1 Å

대표적인 적용 분야

This sputtering coater system is well suited for research and development involving thin film coatings of conductive and non-conductive materials. It is particularly effective for fabricating films in solid-state electrolyte studies, organic light-emitting diodes (OLEDs), and other advanced material investigations requiring precise control over film thickness and composition.

구성 및 작동 안내

The system allows flexible power supply configurations, where a single power supply can operate multiple sputtering heads or each head can be independently powered. For non-conductive targets, an RF power supply is used, while conductive targets utilize a DC power supply. Targets are optional and must be selected according to the material to be deposited.

For optimal performance, non-conductive targets should be mounted with copper backing plates. The system requires high purity (5N) argon gas for plasma sputtering. Safety precautions include shutting down the RF/DC generators before loading samples or changing targets due to high voltage exposure on sputtering heads.

Optional accessories include vacuum pump stations for achieving base pressures below 1e-2 Torr, a digital water chiller for cooling, and an in-situ quartz crystal microbalance for film thickness monitoring. The coater can also be integrated into a glovebox environment for sensitive material handling, which requires separate ordering of the glovebox system.

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