VTC-1RF-SPC 2-in-1 Thin Film Coater with Integrated Magnetron Sputtering and Thermal Evaporation
The VTC-1RF-SPC is engineered to meet the demands of multi-layer thin film fabrication in material science research. It integrates two key deposition techniques—magnetron sputtering and thermal evaporation—within a single stainless steel vacuum chamber, enabling versatile coating processes without the need for multiple systems.
This system supports precise control over film deposition parameters, including adjustable sputtering head-to-sample distance and programmable temperature control for evaporation. Its design facilitates contamination prevention and sample heating up to 700°C, making it suitable for a wide range of conductive and non-conductive materials.
Wichtigste Merkmale
- One 1″ magnetron sputtering head with adjustable distance (60-100 mm) and manual baffle plate to minimize contamination.
- Choice of sputtering power sources: 500 W DC for metallic targets or 300 W RF (13.56 MHz) for non-conductive materials.
- Thermal evaporation source with tungsten heating coil inside an alumina crucible; optional SS316 crucible for lithium metal evaporation.
- Maximum evaporation temperature of 1350°C controlled via a programmable touchscreen temperature controller.
- Stainless steel vacuum chamber (250 mm diameter x 360 mm height) with quartz glass view window and motorized top flange for sample loading.
- Rotary and heatable sample holder (100 mm diameter) with heating up to 700°C and 30-segment programmable temperature control.
- Integrated turbo pump with KF60 flange and electric gate valve, plus gas inlet/outlet ports and valves for vacuum control.
- Digital temperature-controlled recirculating water chiller included for system cooling (5-35°C range, 16 L/min flow).
- 7″ color touchscreen panel for comprehensive control of evaporation temperature, sample stage parameters, vacuum pump, and valves.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Eingangsleistung | Single-phase 220 VAC ±10%, 50/60 Hz, 4200 W (including vacuum pump and water chiller) |
| Magnetron Sputtering Head | One 1″ head with high vacuum quick connector; sputtering from bottom to up; adjustable distance 60-100 mm |
| Sputtering Power Source | DC: 500 W for metals; RF: 300 W, 13.56 MHz for non-conductive materials |
| Thermal Evaporation Source | Tungsten coil in alumina crucible; optional SS316 crucible for Li-metal; max temperature 1350°C |
| Vacuum Chamber | 250 mm diameter x 360 mm height, stainless steel; quartz glass view window 100 mm diameter |
| Sample Holder | Rotary, heatable up to 700°C ±3°C; 100 mm diameter; 30-segment programmable temperature control |
| Vakuumniveau | Max 8 x 10-6 torr (cold state) |
| Wasserkühler | Digital temperature-controlled recirculating chiller; 5-35°C range; 16 L/min flow; 14 psi pump pressure |
| Systemsteuerung | 7″ color touchscreen for evaporation temperature, sample stage temperature and rotation, vacuum pump and valves |
Typische Anwendungsbereiche
Ideal for fabricating multi-layer thin films in material research, including coatings of metals, oxides, and lithium metal films. Suitable for studies requiring precise control of film thickness and composition using both sputtering and evaporation techniques.
Hinweise zur Konfiguration und zum Betrieb
The system includes one magnetron sputtering head and one thermal evaporation source as standard. Optional accessories include a quartz film thickness monitor with 0.10 Å accuracy and a precision thin film and coating analysis system (TFMS-LD) available at extra cost. The vacuum chamber features ports for optional film thickness measurement devices and gas inlet/outlet valves for controlled atmosphere processing.
Safety precautions should be observed when operating high temperatures and vacuum conditions. The system is CE approved, with NRTL certification available upon request.
