VTC-16-3HD-LD Three Rotary Target Plasma Sputtering Coater with 500°C Substrate Heater and Touchscreen Control
The VTC-16-3HD-LD is engineered for laboratory thin film deposition requiring precise control over multi-material coatings on small substrates. It accommodates substrates up to 50 mm in diameter and supports coating with up to three different metallic targets via a rotary stage. This design enables sequential or selective sputtering of various metals without manual target changes, improving process efficiency and film uniformity.
The system integrates a substrate heater capable of reaching 500°C, controlled by a PID controller with ±1°C accuracy, facilitating enhanced film adhesion and quality. Operation is streamlined through a 6-inch color touchscreen panel that consolidates vacuum gauge readings, sputtering current monitoring, substrate temperature control, and process logging. The vacuum chamber is constructed from high-purity quartz with stainless steel sealing flanges, ensuring chemical resistance and vacuum integrity.
Wichtigste Merkmale
- Three rotary sputtering targets with 47 mm diameter, enabling multi-material deposition without interruption.
- Substrate stage diameter of 50 mm with adjustable sputtering distance from 25 to 40 mm.
- Substrate heater with maximum temperature of 500°C and integrated PID temperature control.
- 6-inch color touchscreen interface with PLC integration for comprehensive process control and monitoring.
- Vacuum chamber made of high-purity quartz (150 mm ID) with stainless steel flange and flat O-ring sealing.
- Stainless steel shield cage for operator safety and equipment protection.
- Compatible with a wide range of metallic targets including Ag, Al, Cr, Ni, Pt, Ti, Sn, Li, Mg, with specific recommendations for certain materials.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Eingangsleistung | Single-phase 220 VAC, 50/60 Hz, 700 W (excluding vacuum pump) Requires 1500 W transformer for 110 VAC operation |
| Output Power | 1600 VDC, max 40 mA |
| Vacuum Chamber | Quartz, 150 mm ID x 165 mm OD x 150 mm H Stainless steel flange with flat O-ring seal |
| Sample Stage | 50 mm diameter, rotatable with three sputtering positions Sputtering distance adjustable from 25 to 40 mm |
| Substrate Heater | Maximum 500°C, PID controlled with ±1°C accuracy |
| Systemsteuerung | 6-inch color touchscreen with PLC integration Integrated vacuum gauge, sputtering current meter, and temperature control |
| Sputtering Targets | 47 mm diameter x 2.5 mm max thickness Compatible with various metals including Ag, Al, Cr, Ni, Pt, Ti, Sn, Li, Mg |
| Vacuum Pump Interface | KF25 vacuum port for external vacuum pump connection (not included) |
| Safety Features | Stainless steel shield cage included for protection |
Typische Anwendungsbereiche
This coater is suitable for depositing thin metallic films for research and development in materials science, electronics, and surface engineering. It supports multi-target sputtering for complex alloy or multilayer coatings on small substrates. The integrated heating enables enhanced film adhesion and tailored microstructure formation.
Hinweise zur Konfiguration und zum Betrieb
The system requires an external vacuum pump with a KF25 connector, which is not included. Users may select a double-stage pump for vacuum levels down to 1.0E-2 Torr or a turbopump for higher vacuum down to 1.0E-5 Torr. The vacuum pump can be powered and controlled via the coater’s power outlet.
For optimal film adhesion, substrates should be cleaned ultrasonically with acetone and isopropyl alcohol, dried with nitrogen, and optionally plasma cleaned. A thin buffer layer may be applied to improve adhesion of certain metals. Operators must ensure the equipment is powered down before loading samples or changing targets due to high voltage hazards.
This model is not recommended for coating light metals such as Al, Mg, Zn, or Ni due to its lower sputtering energy; alternative magnetron sputtering or thermal evaporation systems should be considered for those materials.
