VBF-1600X-B Vertical Atmosphere-Controlled Furnace with 11″ I.D. Chamber, 13 Liter Capacity and Automatic Bottom Loading, Up to 1700°C
The VBF-1600X-B furnace is engineered for precise thermal processing tasks such as sintering materials and annealing semiconductor wafers within a controlled atmosphere or vacuum environment. Its vertical design incorporates an 11-inch inner diameter and 13-inch length sealed chamber, providing a working volume of approximately 18 liters. This configuration supports high-temperature operations up to 1600°C continuously, with the capability to reach 1700°C for short durations under tightly controlled conditions.
Wichtigste Merkmale
- Automatic bottom loading with motorized vacuum chamber flange for easy sample insertion and removal.
- Programmable Eurotherm temperature controller with PID control, Auto-Tune, and 24-segment ramp, dwell, and cooling profiles.
- Operating temperature range from 800°C to 1600°C continuously, with short-term peak capability to 1700°C.
- Vacuum-sealed stainless steel chamber with water-cooled flanges and high-purity alumina insulation for thermal stability.
- Integrated mechanical vacuum pump achieving vacuum levels down to 10⁻² torr.
- Touchscreen control panel with temperature and inert gas pressure management, including furnace purging and safety pressure release valve.
- RS485 communication port for PC control; software installation and testing available upon request.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Modell | VBF-1600X-B |
| Kammergröße | 280 mm diameter x 300 mm height (approx. 18 liters) |
| Höchsttemperatur | 1600°C continuous, 1700°C for less than 1 hour |
| Temperaturgleichmäßigkeit | ±0.5°C |
| Heizelemente | Molybdenum disilicide (MoSi2) |
| Stromversorgung | Single-phase 220 VAC, 50/60 Hz, 13 kW max (20 A breaker required) |
| Vakuumniveau | Down to 10⁻² torr via mechanical pump |
| Loading Mechanism | Automatic bottom loading with motorized vacuum flange |
| Temperaturregler | Eurotherm PID controller with Auto-Tune, 1 program, 24 segments |
| Control Interface | Touchscreen panel with gas flowmeters and pressure control |
| Kühlsystem | Included 16 L/min recirculating water chiller |
| Safety Features | Automatic pressure control, safety pressure release valve, thermocouple break protection |
Typische Anwendungsbereiche
Ideal for sintering advanced ceramics, annealing semiconductor wafers, and conducting heat treatments requiring precise atmosphere control and high vacuum. Suitable for research and development in materials science, electronics, and semiconductor fabrication.
Hinweise zur Konfiguration und zum Betrieb
The furnace includes a mechanical vacuum pump, recirculating water chiller, and a programmable temperature controller for immediate operation. Optional PC control software and laptop can be ordered for enhanced process management. Users should ensure proper water cooling and vacuum system maintenance for optimal performance and safety.
