OTF50RF 300W 13.56MHz RF Generator with Automatic Matching for 50 or 80 mm OD Tube Furnace PECVD Systems
The OTF50RF RF generator is engineered to provide precise radio frequency power for plasma-enhanced chemical vapor deposition (PECVD) processes, including plasma etching, plasma cleaning, and plasma polymerization. It is specifically designed to integrate with tube furnaces having outer diameters of 50 or 80 mm, enabling controlled plasma generation within these systems.
This generator operates at a fixed frequency of 13.56 MHz with a frequency stability of ±0.005%, ensuring consistent plasma excitation. The output power is adjustable from 5 to 300 watts with a tight stability tolerance of ±1%, allowing fine control over plasma intensity. An automatic matching network optimizes impedance matching between the generator and the plasma load, minimizing reflected power and enhancing efficiency.
Wichtigste Merkmale
- RF frequency fixed at 13.56 MHz with ±0.005% stability for reliable plasma generation.
- Output power adjustable between 5 and 300 watts with ±1% power stability.
- Automatic impedance matching to reduce reflected power up to 200W maximum.
- Air-cooled design for efficient thermal management during operation.
- RF output port uses a 50 Ω N-type female connector for standard compatibility.
- Compatible with tube furnaces of 50 mm or 80 mm outer diameter; larger coils up to 11 inches available on request.
- Operates on 208-240 VAC power supply at 50/60 Hz.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| RF Frequency | 13.56 MHz ±0.005% |
| Output Power | 5 – 300 W adjustable, ±1% stability |
| Maximum Reflected Power | 200 W |
| Impedance Matching | Automatic matching network |
| RF Output Port | 50 Ω, N-type female connector |
| Cooling Method | Air cooling |
| Stromversorgung | 208-240 VAC, 50/60 Hz |
| Compatible Tube Furnace Outer Diameter | 50 mm or 80 mm (larger coils up to 11″ available on request) |
| Geräuschpegel | Less than 50 dB |
Typische Anwendungsbereiche
This RF generator is ideal for integration with tube furnaces to establish PECVD systems used in thin film deposition, surface modification, plasma etching, and plasma cleaning processes. It supports research and development in materials science, semiconductor fabrication, and surface engineering.
Hinweise zur Konfiguration und zum Betrieb
Optional accessories include oilless vacuum pumps to ensure contamination-free operation, quartz tubes, and vacuum flanges compatible with the tube furnace setup. Users should select the appropriate tube diameter option when ordering. Proper ventilation and adherence to safety protocols for RF equipment operation are recommended.
