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VTC-EV3-GB Thermal Evaporation Coater in Glovebox for 4″ Wafers with 3 Crucibles and Precision Temperature Control

Designed for multilayer thin film deposition on 4" wafers within a controlled glovebox atmosphere.
Equipped with three alumina crucibles and tungsten coil heaters for sequential evaporation.
Temperature range from 200 ºC to 1700 ºC with ±1 ºC accuracy and programmable control.
Rotatable 4" sample holder with adjustable height ensures uniform coating thickness.

Compliance: CE Certified
Customized: OEM/ODM
Package: Plywood case package

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VTC-EV3-GB Thermal Evaporation Coater in Glovebox for 4″ Wafers with 3 Crucibles and Precision Temperature Control

The VTC-EV3-GB system is engineered for precise thermal evaporation coating of thin films on 4-inch wafers, particularly suited for air-sensitive materials handled within a glovebox environment. This setup enables sequential deposition of multilayer metallic or organic films by utilizing three separate evaporation sources housed in a quartz vacuum chamber integrated at the glovebox base. The controlled atmosphere maintains oxygen and humidity levels below 1 ppm, essential for sensitive film growth.

The system features alumina crucibles heated by tungsten coil heaters capable of reaching temperatures from 200 ºC up to 1700 ºC, monitored by B-type thermocouples with ±1 ºC precision. A digital temperature controller supports up to 30 programmable segments, allowing fine-tuned thermal profiles for each evaporation source. The rotatable sample holder accommodates 4″ wafers, with adjustable height and rotation speed of 5 rpm to ensure uniform film thickness across the substrate.

Key Features

  • Integrated quartz vacuum chamber (280 mm OD, 260 mm ID, 310 mm length) within glovebox for air-sensitive processing.
  • Three alumina crucibles with tungsten coil heaters enable multilayer film deposition sequentially in one chamber.
  • Temperature control from 200 ºC to 1700 ºC with ±1 ºC accuracy and 30 programmable segments.
  • 4″ diameter rotatable sample holder with adjustable height (up to 90 mm) and 5 rpm rotation speed for uniform coating.
  • Optional high vacuum capability down to 1.0E-5 Torr using turbomolecular pump.
  • Built-in gas inlet with needle valve for chamber purging or forming gas processing.
  • Optional quartz film thickness monitor for in-situ measurement with accuracy up to 1 Å.

Technical Specifications

Parameter Specification
Vacuum Chamber Dimensions Outer Diameter 280 mm, Inner Diameter 260 mm, Length 310 mm
Sample Holder Diameter 4 inches (rotatable)
Sample Holder Height Adjustment Up to 90 mm
Sample Rotation Speed 5 rpm
Evaporation Sources 3 alumina crucibles with tungsten coil heaters
Temperature Range 200 ºC to 1700 ºC
Temperature Control Accuracy ±1 ºC
Temperature Controller Digital, 30 programmable segments
Thermocouples 3 B-type thermocouples (one per crucible)
Vacuum Capability Up to 1.0E-5 Torr with optional turbopump
Power Supply (Coater) AC 110 V, 50/60 Hz, 1200 W input power
Power Supply (Glovebox) AC 110 V, 50/60 Hz, 1500 W input power
Gas Inlet 1/4″ tube fitting with needle valve

Typical Applications

This system is ideal for depositing multilayer thin films of metals and organic materials on 4-inch wafers, especially when working with air-sensitive compounds requiring an inert glovebox atmosphere. It supports research and development in semiconductor device fabrication, organic electronics, and thin film coatings where precise temperature control and vacuum conditions are critical.

Configuration & Operating Notes

The system includes three alumina crucibles with tungsten coil heaters and B-type thermocouples installed for individual temperature monitoring. The quartz vacuum chamber is integrated into the glovebox base to maintain an inert atmosphere. A vacuum pump is required and can be selected from options including a double-stage rotary vane pump or a turbomolecular pump for higher vacuum levels. Optional accessories include additional alumina crucibles, tungsten coil heaters, and a quartz film thickness monitor for in-situ measurement. Temperature ramp rates should be limited to 0.3 ºC/s below 1200 ºC and 0.15 ºC/s between 1200 ºC and 1700 ºC to ensure system stability and coating quality.

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