VTC-600-2HD-LD Dual-Head 2″ Magnetron Plasma Sputtering Coater with DC and RF Sources for Metallic and Non-Metallic Films
The VTC-600-2HD-LD is engineered for laboratory-scale thin film deposition requiring simultaneous or sequential sputtering of metallic and non-metallic materials. It integrates two independent 2-inch magnetron sputtering heads, one powered by a DC source optimized for conductive metallic targets, and the other by an RF source tailored for non-conductive materials. This configuration enables co-sputtering and multilayer film fabrication across a broad spectrum of materials including alloys, ferroelectrics, semiconductors, ceramics, dielectrics, optical coatings, and PTFE.
The system features a stainless steel vacuum chamber with a 300 mm diameter and 300 mm height, equipped with a 100 mm glass viewport and a hinged top flange for convenient sample access. The sample stage supports rotation speeds from 1 to 20 rpm and heating up to 500°C, controlled via a single-point programmable temperature controller to ensure uniform film deposition. Gas flow is regulated by two mass flow controllers calibrated for nitrogen, with flow rates up to 200 sccm. Optional components include turbomolecular and backing pumps for achieving base pressures below 1e-2 torr, a digital water chiller for cooling, and a quartz crystal microbalance for in-situ film thickness monitoring.
Key Features
- Dual 2″ magnetron sputtering heads with water cooling jackets and shutters for precise film control.
- DC power source delivering up to 500 W for metallic target sputtering.
- RF power source providing 300 W at 13.56 MHz for non-conductive target sputtering.
- Rotating and heating sample stage (Ø140 mm) with temperature control up to 500°C and rotation speeds from 1 to 20 rpm.
- Stainless steel vacuum chamber (Ø300 × 300 mm H) with glass viewport and hinged top flange.
- Two mass flow controllers for gas flow regulation up to 200 sccm, nitrogen calibrated.
- Optional vacuum pump stations and water chillers available for enhanced vacuum and cooling performance.
Technical Specifications
| Parameter | Specification |
|---|---|
| Power Supply | 208-240 VAC, single phase, 50/60 Hz, 500 W |
| DC Source Power | 500 W for metallic materials |
| RF Source Power | 300 W at 13.56 MHz for non-conductive materials |
| Magnetron Sputtering Heads | Two 2″ diameter targets, water-cooled with shutters; target thickness 0.1 – 5 mm (targets optional) |
| Vacuum Chamber | Stainless steel, Ø300 × 300 mm H, 100 mm glass viewport, hinged top flange |
| Sample Stage | Ø140 mm rotating and heating stage, 1-20 rpm, up to 500°C, programmable controller |
| Gas Flow Control | Two mass flow controllers, 0-200 sccm, nitrogen calibrated |
Typical Applications
This coater is suitable for research and development of thin films involving metals, alloys, ceramics, ferroelectrics, semiconductors, dielectrics, optical coatings, and fluoropolymers. It supports multilayer and co-sputtering processes for advanced material synthesis and device fabrication.
Configuration & Operating Notes
Sputtering targets are not included and must be selected based on the desired coating material. For optimal performance with non-conductive targets, copper backing plates are recommended. The system requires high purity argon gas (5N) for plasma generation. Operators must ensure the RF and DC power supplies are turned off before loading samples or changing targets to avoid high voltage hazards. Distilled water should be used in the water chiller to prevent damage. Optional accessories include turbomolecular pumps, backing pumps, water chillers, and quartz crystal microbalances for enhanced vacuum, cooling, and film thickness monitoring capabilities. The coater can be integrated into a glovebox environment upon request for air-sensitive processes.
