VTC-600-2HD-GB-LD Dual-Head 2″ Magnetron Plasma Sputtering Coater Integrated in Oxygen- and Humidity-Free Glovebox
The VTC-600-2HD-GB-LD system is engineered for precise thin film deposition of air-sensitive materials within a rigorously controlled glovebox environment. It provides an oxygen- and humidity-free atmosphere (<1 ppm) essential for coating reactive or sensitive substrates without contamination. This setup is ideal for research and development involving metallic, ceramic, semiconductor, dielectric, and optical thin films requiring stringent environmental control.
The sputtering coater is integrated into the glovebox chamber, which measures 1200 mm by 740 mm by 900 mm and is constructed from stainless steel. The system features two 2″ magnetron sputtering guns mounted on a hinged cover, each powered by dedicated sources: a 500 W DC source for metallic targets and a 300 W RF source at 13.56 MHz for non-conductive materials. This dual-source configuration allows sequential or simultaneous deposition of single or multilayer films from a broad range of materials, including alloys, ferroelectrics, PTFE, and ceramics.
Key Features
- Glovebox environment with automatic purging and regeneration to maintain O2 and H2O below 1 ppm.
- Two 2″ magnetron sputtering heads with water cooling jackets and shutters for precise coating control.
- Integrated DC (500 W) and RF (300 W, 13.56 MHz) power supplies for metallic and non-metallic target materials.
- Rotatable and heatable ceramic sample stage with copper cover, supporting up to 4″ wafers, adjustable rotation speed (1–20 rpm), and temperature control up to 500 °C ±1 °C.
- Vacuum chamber of 300 mm diameter and 300 mm height with hinged lid and pneumatic assist for easy target exchange.
- Two precision mass flow controllers for dual gas inlet with adjustable flow rates up to 200 mL/min and 100 mL/min.
- Included 240 L/min double stage rotary vacuum pump with exhaust filter; no turbopump required due to glovebox purification efficiency.
- Digital temperature-controlled recirculating water chiller with 5–35 °C range and 16 L/min flow rate.
Technical Specifications
| Parameter | Specification |
|---|---|
| Glovebox Chamber Dimensions | 1200 mm (L) × 740 mm (W) × 900 mm (H), stainless steel |
| Vacuum Chamber Size | 300 mm diameter × 300 mm height, stainless steel |
| Sputtering Targets | Two 2″ diameter targets; thickness 0.1–5 mm including backing plate |
| Power Supplies | One DC 500 W for metallic; one RF 300 W, 13.56 MHz for non-metallic |
| Sample Stage | Rotatable and heatable ceramic heater with copper cover; 140 mm diameter; rotation 1–20 rpm; temperature RT to 500 °C ±1 °C (max 2 hr) |
| Gas Flow Control | Two MFCs; flow rates 0–200 mL/min and 0–100 mL/min; 5N purity Ar gas required |
| Vacuum Pump | 240 L/min double stage rotary pump with exhaust filter |
| Water Chiller | Digital temperature control; 5–35 °C; 16 L/min flow; 14 psi pump pressure |
| Power Supply | Single-phase 220 VAC, 50/60 Hz, total 2500 W including pump and chiller |
Typical Applications
This system is suited for depositing thin films of metals, alloys, ferroelectric materials, semiconductors, ceramics, dielectrics, optical coatings, and PTFE in research and development settings. Its controlled glovebox environment enables processing of air- and moisture-sensitive materials without oxidation or contamination, supporting advanced material studies and device fabrication.
Configuration & Operating Notes
The system includes one stainless steel and one research-grade Al2O3 target for demonstration. Optional accessories include a quartz film thickness monitor with 0.10 Å accuracy for in-situ coating thickness measurement. The glovebox features automatic purging and regeneration functions to maintain ultra-low oxygen and humidity levels. Operators should use 5N purity argon gas and follow safety protocols for vacuum and high-voltage equipment. CE approval is granted; NRTL certification is available upon request.
