VHP-5000N2 Compact Vacuum Hot Flat Press for Wafer Bonding with 50x50mm Heating Plates, 500°C Max Temperature, and 5000N Pressing Force
The VHP-5000N2 is engineered to facilitate advanced wafer bonding and film transfer processes essential in semiconductor device research, particularly for third-generation materials. It accommodates samples up to 50mm by 50mm in area and 15mm in thickness, providing a controlled vacuum environment to reduce oxidation during bonding or sintering operations.
This compact hot press features dual heat-resistant stainless steel plates integrated inside a vacuum chamber, capable of reaching a maximum temperature of 500°C for short durations and continuous operation at 450°C. The pressing system delivers up to 5000N (500kg) force with precise control, suitable for packaging interconnection materials in semiconductor fabrication.
Key Features
- Vacuum chamber constructed from 304 stainless steel with stiffeners to prevent deformation and equipped with a 4-inch observation window.
- Dual independent digital temperature controllers for upper and lower heating plates with ±1°C accuracy.
- Heating plates sized 50mm x 50mm with flatness ≤0.005mm (cold) and heating rate of 10°C/min.
- Electric oil-free press with manual and automatic modes, 30mm stroke, and pressure accuracy ±10N in auto mode.
- Vacuum capability below 5×10⁻² torr with ports for vacuum pump and wiring connections.
- Programmable temperature profiles with up to 30 segments for heating, dwelling, and cooling phases.
- Optional chilled water recirculator and vacuum pumps available but not included.
Technical Specifications
| Parameter | Specification |
|---|---|
| Power Supply | 110V or 208V selectable, single phase, 50/60 Hz |
| Power Consumption | 250W total (200W heating) |
| Heating Plates Material | Heat-resistant stainless steel |
| Heating Plates Size | 50mm x 50mm |
| Maximum Temperature | 500°C (up to 30 minutes), continuous 450°C |
| Temperature Accuracy | ±1°C (±3°C at 500°C) |
| Sample Size Limit | 50mm x 50mm x 15mm |
| Pressing Force | Max 5000N (500kg) at 500°C |
| Press Stroke | 30mm |
| Pressure Control Range | 1-500kg (10-1000N) |
| Vacuum Level | <5×10⁻² torr (cold, 30 min pumping) |
| Vacuum Chamber Material | 304 stainless steel with stiffeners |
| Observation Window | 4-inch diameter |
Typical Applications
This hot flat press is ideal for research and development involving wafer bonding, sintered bonding of semiconductor materials, film transfer, and packaging interconnection processes. It supports experiments requiring precise temperature and pressure control in a vacuum or controlled atmosphere to minimize oxidation and contamination.
Configuration & Operating Notes
The system requires an external chilled water recirculator (such as the KJ5000 Digital Recirculating Water Chiller) and vacuum pump (options include the FYP-Pump rotary pump or PV-HVS-LD turbo pump) which are not included. Users should operate the press in a dust-free environment and wear appropriate protective gear due to burn risks. The press automatically resets to its lowest position on startup. Gas cylinder pressure should not exceed 0.2MPa for safety.
