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MSK-AFA-MR200 Roll-to-Roll Slot Die Coater for Ultrathin Film Coating on Sheet or Roll Substrates, Up to 180 mm Width

Designed for precise ultrathin film coating on flexible substrates in research and production.
Supports continuous or multiple strips coating with adjustable slot die head orientation.
Operates with low-viscosity solutions (under 1000 cP) and achieves film thickness below 10 µm.
Equipped with syringe pump feeding and convection oven heating up to 120°C.

Compliance: CE Certified
Customized: OEM/ODM
Package: Plywood case package

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MSK-AFA-MR200 Roll-to-Roll Slot Die Coater for Ultrathin Film Coating on Sheet or Roll Substrates

The MSK-AFA-MR200 is engineered to meet the demands of ultrathin film deposition on flexible substrates, such as polymer films or foils, used in photovoltaic devices, fuel cells, OLEDs, and battery electrodes. It enables precise coating of films thinner than 10 microns using low-viscosity solutions (less than 1000 cP), facilitating uniform and consistent layer formation essential for advanced material research and development.

This system accommodates both roll and sheet substrates with widths up to 180 mm, allowing continuous or segmented strip coating. The slot die coating head is adjustable to vertical, 45-degree, or horizontal orientations to optimize coating uniformity depending on the substrate and process requirements. The compact design includes a convection oven for controlled drying and a syringe pump for automated slurry feeding, supporting coating speeds up to 0.5 m/min.

Key Features

  • High-precision slot die coating with film thickness control down to ≤10 µm
  • Adjustable slot die head angles: vertical, 45°, and horizontal for process flexibility
  • Compatible with dilute solutions below 1000 cP viscosity for ultrathin films
  • Supports both roll-to-roll and sheet substrates up to 180 mm wide
  • Automated syringe pump feeding with volumes from 10 mL to 30 mL, optional larger pumps available
  • Integrated forced convection oven with temperature control up to 120°C for drying
  • Touchscreen HMI with PLC control; coating and control units can be separated for glovebox integration
  • Optional atmosphere plasma treatment for substrate surface activation

Technical Specifications

Parameter Specification
Voltage 208 – 240 VAC, 50/60 Hz, Single Phase (110 VAC optional via transformer)
Power Consumption 4 kW total; Heating power 1.8 kW
Slot Die Head Material Stainless Steel (SUS630)
Maximum Coating Width 180 mm
Coating Thickness Range 5 – 300 µm (single layer, dependent on slurry and process parameters)
Coating Speed 0 – 0.5 m/min, adjustable via touchscreen
Substrate Width Up to 200 mm
Substrate Thickness 6 – 30 µm
Syringe Pump Volume 10 mL, 20 mL, 30 mL (larger pumps optional)
Syringe Pump Feeding Speed 0.01 – 10 mm/s
Drying Temperature Up to 120°C with ±1°C accuracy
Temperature Uniformity ±5°C
Unwinding Roller Diameter 200 mm
Unwinding Roller Width 230 mm
Reeling/Unreeling Shaft Diameter 75 mm (mechanical expanding shaft)
Maximum Tension Control 20 N
Shim Thickness Options 0.1, 0.2, 0.3, 0.4, 0.5 mm
Control Interface Touchscreen HMI with PLC control
Compressed Air Requirement 0.5 – 0.8 MPa (air compressor not included)

Typical Applications

This coater is ideal for fabricating ultrathin films in photovoltaic research, especially perovskite solar cells, as well as for coating fuel cell membranes, OLED layers, polymer ion conductors, and battery electrode films. Its ability to handle both sheet and roll substrates makes it versatile for lab-scale development and pilot production.

Configuration & Operating Notes

The coating unit can be separated from the control unit, enabling placement inside a glove box with an inert Argon atmosphere for air-sensitive materials. Optional accessories include atmosphere plasma treatment to enhance substrate surface energy and improve coating adhesion, as well as larger syringe or screw pumps for higher volume slurry feeding. The system requires an external compressed air supply and can be equipped with filtration systems for vapor and magnetic particle removal upon request.

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