HVMSS-SPC-1-LD 1-Inch Magnetron Sputtering Source with Flexible Head for RF and DC Sputtering Coaters
The HVMSS-SPC-1-LD is engineered for laboratory thin film coating applications requiring precise and uniform deposition of various materials. It is especially suited for use in vacuum chambers where magnetron sputtering is employed to deposit metallic, insulating, magnetic, or non-magnetic targets. This sputtering source accommodates 1-inch diameter targets up to 3 mm thick and is compatible with DC, pulsed DC, and RF power supplies, enabling broad material versatility.
Its design incorporates a flexible sputtering head that can tilt ±45 degrees to optimize the angle of ion bombardment, enhancing sputtering efficiency. The source uses rare-earth NdFeB magnets isolated from the cooling water to minimize vacuum interface issues and corrosion, improving durability and ease of maintenance. The system operates effectively under low-pressure argon atmospheres (approximately 1 mTorr to 1 Torr), which reduces gas collisions and improves film quality.
Key Features
- Flexible sputtering head with ±45° tilt for adjustable incidence angles.
- High field strength and uniform magnetic field profile designed via electromagnetic finite element analysis.
- Compatible with DC (up to 250 W), pulsed DC, and RF (up to 100 W) power supplies.
- Includes 1″ copper backing plate and one copper target as standard accessories.
- Magnets coated for corrosion resistance and isolated from cooling water to enhance longevity.
- Standard ¾” outer diameter shaft for mounting and installation.
- Low impedance sputtering head with standard RF connector for easy interface.
Technical Specifications
| Parameter | Specification |
|---|---|
| Sputtering Head Diameter | 1.82″ (46.3 mm) |
| Target Diameter | 1.0 ± 0.02″ (25.4 mm) |
| Maximum Target Thickness | 1/8″ (3 mm) |
| Magnets | NdFeB Rare Earth Magnets |
| Shaft Diameter | 3/4″ O.D. |
| Electrical Connector | Standard SL16 cable connector (HN type for DC and RF) |
| Power Requirements | DC max 250 W, RF max 100 W |
| Cathode Sputtering Current | Max 3 A |
| Cathode Sputtering Voltage | 200 – 1,000 V |
| Operating Pressure Range | ~1 mTorr to 1 Torr (Argon) |
| Water Cooling | Required; 1/2 GPM filtered flow, inlet temperature <20°C, 4 mm O.D. tubing |
| Sputtering Source Bakeable Temperature | Up to 200°C |
Typical Applications
The HVMSS-SPC-1-LD is ideal for research and development of thin film coatings in laboratories, including deposition of metals, oxides, and other materials on substrates for electronics, optics, and surface engineering. Its flexible head and compatibility with multiple power modes allow it to handle a variety of target materials, including insulating and magnetic types.
Configuration & Operating Notes
The sputtering gun includes a 1″ copper backing plate and one copper target as standard. Optional accessories include a 148 cm RF cable with SL6 connector and a 6″ CF vacuum flange with high vacuum feedthrough for chamber integration. Water cooling is mandatory to maintain operational stability and prevent overheating. The sputtering head’s tilt assembly features scribe lines for precise angle adjustment. Installation requires common tools and the use of a high vacuum quick disconnect for mounting to vacuum chamber baseplates with 1″ diameter through-holes. Target changes are straightforward and do not require bonding.
