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Unipol-1502 Precision Polishing Machine with 15″ Lapping Plate for Up to One 8″ or Three 4″ Wafers, Touch-Screen Control

Designed for high-precision polishing of semiconductor wafers, crystal components, and ceramic substrates.
Supports polishing of samples up to 8" diameter with multiple workstations.
Equipped with two flat lapping plates and variable speed control up to 125 RPM.
Includes adjustable timer for automatic stop and digital speed display.

규정 준수: CE 인증 획득
맞춤형: OEM/ODM
포장: 합판 케이스 포장

제품

Unipol-1502 Precision Polishing Machine with 15″ Lapping Plate for Up to One 8″ or Three 4″ Wafers

The Unipol-1502 is engineered for precision polishing tasks involving semiconductor wafers, crystal components, and ceramic substrates. It accommodates samples up to 8 inches in diameter, offering flexibility for high-quality polishing of smaller sizes and decent quality for the maximum size. This machine is also suitable for metallographic sample preparation through grinding and polishing.

The system features a 15-inch diameter super flat lapping plate and includes two flat lapping plates with flatness better than 0.25 micron per square inch. One plate is cast iron designed for lapping, while the other is cast aluminum intended for holding polishing pads. The machine supports multiple workstations: three for 4″ samples, one for 6″ samples, and one for 8″ samples, enabling batch processing and versatility.

주요 기능

  • Two flat lapping plates included: 15″ cast iron and 15″ cast aluminum with flatness < 0.25 micron/in².
  • Supports polishing of up to one 8″ wafer or three 4″ wafers simultaneously.
  • Variable speed control from 0 to 125 RPM with digital display for precise operation.
  • Adjustable timer allowing automatic stop from 0 to 99 hours for unattended processing.
  • Touch-screen control interface for ease of use and process monitoring.
  • Multiple workstations for different sample sizes to optimize throughput and quality.
  • CE certified with optional NRTL certification available.

기술 사양

매개변수 사양
전압 AC 208-240V, 50/60 Hz
전력 400 W
Lapping Plate Diameter 15 inches
Flatness of Plates < 0.25 micron/in²
Sample Capacity Up to one 8″ wafer or three 4″ wafers per run
Workstations Three for 4″ samples, one for 6″ sample, one for 8″ sample
Speed Range 0 to 125 RPM, digital display
타이머 Adjustable 0 to 99 hours auto-stop

대표적인 적용 분야

The Unipol-1502 is ideal for polishing semiconductor wafers, crystal components, and ceramic substrates requiring high surface flatness and finish. It is also used for metallographic sample preparation in materials research and quality control laboratories.

구성 및 작동 안내

The machine includes two flat lapping plates, sample holders, conditioning rings, and polishing pads. Optional accessories include multi-sample polishing fixtures for up to 3 x 8 pcs of 1″ diameter samples, a 4″ polishing fixture with pressure indicator for ultra-flat polishing, and precision thickness checkers with 0.001 mm resolution. An automatic slurry feeder is available but not included. Users should ensure proper handling of consumables and follow safety guidelines during operation.

Dimensions & Shipping

Product dimensions 720mm L x 580mm W x 380mm H
Shipping dimensions 580 x 720 x 380, mm (L x W x H)

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