MSK-BSL-H200 Roll-to-Roll Hot Laminator for Tri-Layer Composite with 200 mm Width and Max 120°C Temperature
The MSK-BSL-H200 is engineered for the controlled hot lamination of tri-layer composite materials using a roll-to-roll process. It is particularly suited for applications requiring precise thermal and pressure control to bond multiple layers effectively while maintaining substrate integrity. The laminator accommodates substrates up to 180 mm wide and applies heat up to 120°C, enabling optimal adhesion without damaging sensitive materials.
This system utilizes a pair of rollers—a stainless steel roller and a rubber roller, each 120 mm in diameter—to apply uniform pressure up to 0.6 tons across the lamination width of 200 mm. Pneumatic operation is supported by compressed air at 0.5 to 0.8 MPa, facilitating consistent lamination pressure and speed control up to 5 meters per minute. Protective layers can be applied during lamination to shield the composite surfaces and removed post-process, ensuring high-quality finishes.
주요 기능
- Roll-to-roll lamination designed for tri-layer composite materials with substrate width under 180 mm.
- Adjustable lamination temperature up to 120°C for controlled thermal bonding.
- Maximum lamination pressure of 0.6 tons applied via stainless steel and rubber rollers (120 mm diameter).
- Pneumatic operation requiring 0.5–0.8 MPa compressed air for consistent pressure and speed control.
- Lamination speed adjustable up to 5 meters per minute for process flexibility.
- Protective layers can be used during lamination to prevent surface damage, removable after pressing.
기술 사양
| 매개변수 | 사양 |
|---|---|
| Power Supply | AC 208-240 V, 50/60 Hz, Single Phase |
| Power Consumption | 3.85 kW |
| Compressed Air | 0.5 – 0.8 MPa (for pneumatic operation) |
| Rollers | One stainless steel roller (Ø120 mm), one rubber roller (Ø120 mm) |
| Roller Width | 200 mm |
| Maximum Laminating Width | Substrate width less than 180 mm |
| Laminating Speed | Up to 5 m/min |
| Maximum Lamination Pressure | 0.6 tons |
| Lamination Gap | Up to 2 mm (gauge resolution 1 µm) |
| Maximum Lamination Temperature | 120°C (adjustable) |
| Winding Roller Diameter | Up to 200 mm (3″ cardboard core) |
| Certifications | NRTL or CSA certification available upon request (extra cost) |
대표적인 적용 분야
This laminator is ideal for research and production environments requiring precise lamination of tri-layer composites, such as in flexible electronics, battery electrode fabrication, and advanced material prototyping. It supports delicate substrates needing controlled heat and pressure to achieve uniform bonding without damage.
구성 및 작동 안내
The MSK-BSL-H200 requires a compressed air supply within 0.5 to 0.8 MPa for pneumatic roller operation. Protective lamination layers can be applied during processing to prevent surface damage and removed afterward. Optional certifications such as NRTL or CSA can be requested at additional cost. Operators should ensure substrate roll weight and diameter limits are observed to maintain optimal performance and safety.
