UNIPOL1203 12-Inch High-Speed Automatic CMP Polisher with Dual Stations and Auto Slurry Feeder
The UNIPOL1203 is engineered to perform high-precision chemical mechanical polishing (CMP) tasks, essential for achieving ultra-flat and smooth surfaces on various materials. Its design incorporates corrosion-resistant materials to withstand aggressive chemical environments typically encountered during CMP processes.
This polisher features two independent working stations, allowing simultaneous processing or flexible operation. An integrated automatic slurry feeder precisely controls abrasive slurry delivery, enhancing polishing consistency and efficiency. The system is controlled via a color touch screen interface, enabling fine adjustments of rotational speeds, yoke movement, and polishing duration.
주요 기능
- Super flat stainless steel polishing plate with flatness better than 0.25 micron per square inch.
- High precision rotating plate run-off less than 5 microns ensures uniform polishing.
- Dual working stations with independent control for enhanced productivity.
- Automatic slurry feeder with adjustable feeding speed compatible with abrasive slurries up to 40 microns particle size.
- High precision polishing controller for pressure and flatness adjustments.
- Machine body constructed from anti-corrosive materials to resist chemical damage.
- Color touch screen for intuitive operation and parameter setting.
기술 사양
| 매개변수 | 사양 |
|---|---|
| Polishing Plate Diameter | 300 mm (12″) |
| Polishing Plate Speed | 1 – 240 rpm adjustable |
| Number of Working Stations | 2 (independent control) |
| Sample Holder Diameter | 105 mm |
| Conditioning Ring Diameter | 127.5 mm |
| Power Supply | 208 – 240 VAC, 50 Hz, 450 W |
| Slurry Feeder Volume | Up to 1.0 gallon (~3.8 L) |
| Slurry Particle Size Compatibility | Less than 40 microns |
| Slurry Feeder Rotation Speed | 8 – 20 rpm |
대표적인 적용 분야
The UNIPOL1203 is suitable for polishing semiconductor wafers, optical components, and metallographic samples requiring ultra-flat surfaces. It is widely used in research laboratories and industrial settings for sample preparation and surface finishing.
Configuration and Operating Notes
Optional accessories include a high precision polishing fixture supporting samples up to 100 mm diameter and 12 mm thickness, and an upgraded four-channel automatic slurry feeder. The machine requires careful cleaning after each use with water only; avoid oil-based or chemical cleaning agents. Gradual speed ramp-up is recommended to protect motor control circuitry. Proper sample loading and balanced placement are essential for optimal polishing results.
Dimensions & Shipping
| Product dimensions | 300 mm diameter | 550 mm L × 700 mm W × 420 mm H without optional accessories; 1,000 mm L ×700 mm W × 870 mm H with optional accessories |
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