SYJ-1610 Precision Dicing Saw with Air Bearing for 6-Inch Maximum Wafer Diameter
The SYJ-1610 is engineered to meet the demanding requirements of precision wafer dicing for semiconductor and microelectronic applications. It accommodates wafers up to 6 inches in diameter, providing exceptional cutting accuracy and surface quality. This system is ideal for processing delicate materials where minimal mechanical stress and high repeatability are critical.
Utilizing an air bearing spindle, the SYJ-1610 achieves high rigidity and low vibration, resulting in reduced noise and extended equipment lifespan. The machine is controlled by an industrial computer system featuring a 15-inch industrial-grade LCD touchscreen, enabling intuitive operation, real-time status monitoring, and flexible programming of multiple cutting processes to suit various materials and cutting methods.
주요 기능
- Air bearing spindle for enhanced precision, rigidity, and low noise operation.
- Adjustable spindle speed ranging from 3000 to 50000 rpm with 1.5 kW output power.
- Y-axis controlled by grating closed-loop system with mathematical modeling for superior accuracy.
- Integrated LED ring light and coaxial lighting with microscope auto-focus for precise alignment.
- Industrial computer control with 15-inch LCD touchscreen and Windows XP-based PC system.
- Self-locking cutting space and multiple safety protections including compressed air, cooling water, power supply monitoring, and alarm prompts.
- Supports dicing blades with diameters from 50 mm to 60 mm and cutting depths up to 1.5 mm.
기술 사양
| 매개변수 | 사양 |
|---|---|
| 전압 | AC 220±10% Single Phase |
| 전력 | 3 kW |
| Spindle Speed | 3000 – 50000 rpm |
| Spindle Output Power | 1.5 kW |
| X-Axis Cutting Stroke | 240 mm Max. |
| X-Axis Velocity Range | 0 – 400 mm/s |
| Y-Axis Cutting Stroke | 165 mm Max. |
| Y-Axis Single Stepping Accuracy | 0.003 mm per 5 mm |
| Maximum Y-Axis Error | 0.005 mm per 160 mm |
| Z-Axis Effective Travel | 30 mm Max. |
| Z-Axis Repositioning Accuracy | 0.001 mm |
| Z-Axis Cutter Diameter Range | 50 mm to 60 mm |
| Theta Axis Drive Mode | Direct Drive Motor |
| Theta Axis Angle Range | 320° |
| Theta Axis Resolution | 1 arcminute (1′) |
| Lighting Source | LED Ring Light and Coaxial Light |
| CCD | Industrial Camera |
| Monitor | 15-inch Industrial Grade LCD Touchscreen |
| Control System | PC-Based, Windows XP |
| Standard Dicing Blade Flange | Accepts 40 mm ID x 50.8 – 60 mm OD x 0.035 – 0.35 mm thickness blades |
| Maximum Cutting Depth | 1.5 mm |
대표적인 적용 분야
The SYJ-1610 is suited for precision dicing of semiconductor wafers, MEMS devices, LED substrates, and other delicate materials requiring high accuracy and minimal mechanical stress during cutting. It supports various cutting methods adaptable to different material properties and thicknesses.
구성 및 작동 안내
The system includes a standard pair of flanges for mounting dicing blades and supports custom flange options upon request. Cooling water connections require a Φ12 mm port with recommended industrial circulating water chillers for spindle cooling and cutting water supply. Compressed air supply must be oil-free, dry, and impurity-free with specified pressure and flow rates; the compressor is sold separately. Multiple safety features such as self-locking cutting space and alarm prompts enhance operational safety.
Dimensions & Shipping
| Product dimensions | Working Size: Φ6′; Round Table: Φ6′; Square table: 160mm × 160mm; Volume (W × D × H) mm: 675 × 885 × 1665 |
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