SYJ-30QY Precision CNC Round Cylinder Sample Puncher with Diamond Hollow Core Drill Bits
The SYJ-30QY is engineered for laboratory applications requiring precise cylindrical or round wafer samples extracted from bulk materials up to 50 mm thick. It is capable of producing samples with diameters ranging from 3 to 30 mm, making it ideal for preparing specimens for transmission electron microscopy (TEM) and scanning electron microscopy (SEM) analysis. This sampler accommodates a wide variety of materials including metal alloys, semiconductors, ceramics, and plastics.
The device employs a brushless magnetic DC motor with variable speed control up to 2750 rpm, enabling precise cutting operations. The Z-axis is CNC-controlled with a maximum travel of 100 mm and a moving resolution of 0.0025 mm, ensuring accurate cutting depth up to 50 mm. Manual adjustments are available for the X and Y axes, with maximum ranges of 100 mm and 80 mm respectively. The control unit is separate and features a touchscreen interface for setting parameters such as rotation speed, cutting depth, and cutting speed.
주요 기능
- Precision CNC control with 0.0025 mm moving resolution and 0.01 mm position accuracy.
- Brushless magnetic DC motor with variable speed up to 2750 rpm and 180W power consumption.
- Diamond hollow core drill bits for high-precision cutting; two 27 mm ID bits included.
- Water cooling system with jetting, draining, and splash protection; includes coolant circulating tank with 200W transfer for 110V use.
- Separate touchscreen control unit for easy parameter adjustments.
- Manual X and Y axis adjustments for flexible sample positioning.
- Complete accessories included: water container, quick clamps, resin ceramic plates, and wax rods for sample mounting.
기술 사양
| 매개변수 | 사양 |
|---|---|
| 전압 | AC 100V ~ 240V |
| Motor | Brushless magnetic DC motor (90V), variable speed up to 2750 rpm, 180W power consumption |
| Cutting Speed Range | Z-axis: 100 mm max, CNC controlled; Y-axis: 80 mm max, manual; X-axis: 100 mm max, manual |
| Accuracy | 0.0025 mm moving resolution; 0.01 mm position accuracy |
| Max Cutting Depth | 50 mm |
| Diamond Drill Bits | Two sets included with 27 mm ID; available sizes 3-30 mm; custom sizes on request |
| Water Cooling | Includes water jetting, draining, splash protection, coolant circulating tank with 200W transfer for 110V |
| Control Unit | Separate touchscreen unit for parameter setting |
대표적인 적용 분야
Ideal for preparing cylindrical or round wafer samples from diverse materials such as metal alloys, semiconductor wafers, ceramics, and plastics. Commonly used for sample preparation in electron microscopy analyses including TEM and SEM. Examples include Ga metal cylinders, BN wafers, NdFeB discs, and ceramic holes.
구성 및 작동 안내
The standard package includes two diamond hollow core drill bits with 27 mm inner diameter; users should confirm drill size requirements before ordering. The system incorporates a water cooling assembly with adjustable nozzles and protective splash cover featuring an electrical cooling safety interlock. For enhanced illumination during operation, a fiber optic Y-shape dual light microscope illuminator is recommended (sold separately). Cheaper diamond plated drills are not suitable for brittle samples. Accessories such as water container, quick clamps, resin ceramic plates, and wax rods are provided for immediate sample mounting and processing.
