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STX-1203B Automated Precision Diamond Wire Saw with Touch-Screen Control and 12″ Diameter Cutting Capacity

Designed for precise cutting of large crystals and hard materials up to 12" diameter.
Features stepper motor-driven multi-axis control and programmable cutting parameters via touch screen.
Uses 0.3mm diameter diamond-impregnated wire with adjustable tension and wire speed up to 15 m/s.

규정 준수: CE 인증 획득
맞춤형: OEM/ODM
포장: 합판 케이스 포장

제품

STX-1203B Automated Precision Diamond Wire Saw with Touch-Screen Control and 12″ Diameter Cutting Capacity

This saw employs a diamond-impregnated wire approximately 0.3 mm in diameter, driven by a wire rotating speed adjustable up to 15 meters per second. The cutting process is controlled via a 7-inch color LCD touch screen PLC controller, allowing precise programming of feed speed, cutting depth, slice count, and width. The Y and Z axes, along with the rotary sample stage, are powered by stepper motors for stable and accurate multi-axis movement.

주요 기능

  • Capable of cutting boules up to 12″ (300 mm) diameter and 300 mm height.
  • Diamond wire diameter ranges from 0.25 to 0.35 mm with 150 m length.
  • Stepper motor-driven Y, Z axes and rotary stage for precise multi-axis control.
  • Touch screen PLC controller for customizable cutting parameters including speed and slice number.
  • Adjustable wire tension via built-in pneumatic valves (requires external air pump).
  • Integrated coolant system with tank and immersion pumps using oil-based lubricants.
  • Optional accessories include tilting and rotation stages, digital pressure regulator, and air compressor.

기술 사양

매개변수 사양
Power Supply AC 220 V, 50/60 Hz, 350 W (110 V optional)
Frame Material Heavy-duty Aluminum Alloy
Controller PLC with 7″ Color LCD Touch Screen
Max Workpiece Size Ø300 mm × 300 mm height
Z Axis Travel Range 0.01 – 300 mm (±0.01 mm)
Cutting Speed (Z Axis) 0.05 – 40 mm/min (±0.01 mm)
Backing Speed (Z Axis) 1 – 100 mm/min (±0.01 mm)
Y Axis Travel Range 0.01 – 300 mm (±0.01 mm)
Rotary Stage Range 0.01 – 360° (±0.032°)
Wire Rotating Speed 0 – 15 m/s
Diamond Wire Ø 0.25–0.35 mm, 150 m length (±0.03 mm accuracy)
Wire Tension 1.5–58 PSI via pneumatic valves (air pump required, not included)
Cooling System Coolant tank with two immersion pumps; use oil-based coolant only

대표적인 적용 분야

Ideal for slicing large semiconductor crystals such as silicon, germanium, and gallium arsenide with high precision and minimal surface damage. Also suitable for cutting other hard materials requiring smooth finishes and controlled slicing thickness.

구성 및 작동 안내

The saw requires an external air compressor with pressure above 20 PSI to operate the pneumatic wire tension system; this compressor is not included. Proper use of oil-based cutting fluids is mandatory to prevent corrosion and maintain wire sharpness. Water or tap water must not be used as coolant. For cutting sticky or non-ferrous materials, frequent wire dressing with the included dressing stone is recommended to maintain cutting efficiency. Optional accessories such as tilting and rotation stages, digital pressure regulators, and air compressors are available to enhance functionality and cutting speed.

Dimensions & Shipping

Product dimensions & Weight; 1120x960x1820mm (LxWxH)

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