YLJ-5VHP Vacuum Hot Lamination Press with 400×400 mm Platens, 500°C Max Temperature, and Up to 40T Pressing Force
The YLJ-5VHP is a precision vacuum hot lamination press engineered for advanced laboratory applications such as wafer bonding, thin-film transformations, and liquid crystal polymer (LCP) lamination. It is designed to operate under vacuum or inert gas atmospheres, providing a controlled environment essential for high-quality lamination and bonding processes.
This model features large heating platens measuring 400 × 400 mm, allowing for processing of sizable samples. The system achieves a maximum temperature of 500°C with independent PID-controlled upper and lower platens, ensuring precise thermal management. The pressing force can reach up to 40 metric tons at room temperature and 30 metric tons at elevated temperatures, enabling effective bonding pressure for various materials.
Wichtigste Merkmale
- Heating platens made from high-temperature alloy with integrated water-cooling jackets for thermal stability.
- Independent temperature control of upper and lower platens with programmable PID controllers supporting 30 segments.
- Vacuum chamber constructed from stainless steel 304 with a vacuum-sealed hinged door and quartz observation window.
- Electric hydraulic pump providing up to 40 metric tons pressing force at room temperature and 30 metric tons at 500°C.
- Integrated digital pressure controller with automatic pressure cutoff and ±0.01 MPa accuracy.
- Supports vacuum levels down to approximately 10-4 Torr with optional turbomolecular pump.
- CE certified with optional NRTL or CSA certification available.
Technische Daten
| Spezifikation | YLJ-5VHP |
|---|---|
| Voltage & Power | 208–240 VAC, 50/60 Hz, single-phase, 6,500 W |
| Heating Platen Area | 400 × 400 mm (approx. 16″ × 16″) |
| Maximum Opening Between Platens | 40 mm |
| Chamber Dimensions (L × W × H) | 700 × 650 × 550 mm |
| Kammerkapazität | Approximately 250 L |
| Maximum Pressing Force at 500 °C | 30 metric tons |
| Maximum Pressing Force at Room Temperature | 40 metric tons |
| Genauigkeit der Temperaturregelung | ±1°C with PID auto-tuning |
| Maximum Operating Temperature | 500°C under vacuum or inert gas |
| Pressure Accuracy | ±0.01 MPa (approx. 0.1 kgf/cm²) |
| Vacuum Level Capability | Down to ~10-4 Torr with optional turbomolecular pump |
| Cooling Water Flow Requirement | >16 L/min for platen temperatures above 200°C |
Typische Anwendungsbereiche
Ideal for vacuum hot lamination and bonding of wafers, thin-film processing, and lamination of liquid crystal polymers. Also suitable for research on thermoelectric modules by applying differential heating and cooling across samples.
Hinweise zur Konfiguration und zum Betrieb
The system includes an electric hydraulic pump beneath the support table and a vacuum chamber with a quartz observation window. Independent temperature controllers allow programmable heating profiles with over-temperature and thermocouple break protections. Water cooling is mandatory above 200°C platen temperature, with a flow rate exceeding 16 L/min. Optional accessories include mechanical and high-vacuum pumping systems and recirculating water chillers for enhanced temperature management.
