SYJ190 Multi-Blade Low Speed Precision Saw with 6″ Diamond Cutting Blades for Dicing Up to 4″ Wafers
The SYJ190 is engineered to perform precise dicing of wafer samples up to 4 inches in diameter, addressing the need for accurate and low-damage cutting in semiconductor and materials research laboratories. Its multi-blade design allows simultaneous use of multiple diamond cutting blades, expanding its capability to handle a variety of sample materials with high precision.
To ensure exact sample alignment, the saw incorporates a 2D tiltable and adjustable positioning stage combined with a digital micrometer for fine control of sample travel distance. During operation, a cooling fluid system is employed to dissipate heat generated by cutting, thereby reducing thermal stress and potential damage to sensitive samples.
Wichtigste Merkmale
- Multi-blade setup supporting two 6″ impregnated diamond blades and one 6″ edge-sintered diamond blade included.
- Adjustable rotational speed from 50 to 680 rpm with digital display for precise control.
- Maximum cutting depth of 10 mm and cutting width of 120 mm.
- 2D tiltable sample stage with ±10° tilt and 360° horizontal rotation for versatile positioning.
- Digital micrometer enables accurate adjustment of sample travel distance during cutting.
- Integrated cooling fluid system to minimize heat-induced damage and maintain blade efficiency.
- Includes angle adjustable sample holder and mini-vise accommodating specimens up to 4″ diameter.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Stromversorgung | 100-220 VAC to 24 VDC adapter (NRTL certified), 10A fuse |
| Rated Power | 225 W |
| Speed Range | 50 – 680 rpm, digitally adjustable |
| Cutting Blades Included | Two 6″ O.D. x 0.47″ I.D. x 0.6 mm impregnated diamond blades; one 6″ edge-sintered diamond blade |
| Maximum Cutting Depth | 10 mm |
| Cutting Width | 120 mm |
| Sample Stage | 2D tiltable ±10°, 360° horizontal rotation, digital micrometer for travel adjustment |
| Sample Holder | Angle adjustable holder with mini-vise for specimens up to 4″ diameter |
| Kühlsystem | Cooling fluid system to reduce thermal damage during cutting |
| Zertifizierungen | CE certified; NRTL or CSA certification available upon request |
Typische Anwendungsbereiche
Ideal for precision dicing of semiconductor wafers, ceramics, and other hard materials requiring low-speed, low-damage cutting. Suitable for research and development environments where accurate sample preparation is critical.
Hinweise zur Konfiguration und zum Betrieb
The standard package includes two impregnated diamond blades, one edge-sintered diamond blade, an angle adjustable sample holder, and a mini-vise. Optional blades such as full sintered diamond, SiC arbor, and Al2O3 blades are available upon request at additional cost.
Use of an appropriate anti-corrosion coolant is essential to prevent rusting of machine components. Oil-based coolants or specialized lubricants like LubeCool-150 are recommended; tap water should never be used directly. Regular cleaning with lubricants such as WD-40 is advised to maintain smooth axis movement and prevent corrosion.
