SYJ-400 CNC Dicing and Cutting Saw for 4″ Diameter Wafers and Components up to 8″ x 4″ x 1″
The SYJ-400 is a CNC-controlled dicing and cutting saw engineered for research and development applications involving microelectronics and material science. It is capable of processing wafers up to 4 inches in diameter and components measuring up to 8 inches in length, 4 inches in width, and 1 inch in height. This equipment is ideal for precise sectioning tasks where accuracy and repeatability are critical.
Equipped with a brushless magnetic DC motor, the SYJ-400 offers variable spindle speeds up to 3000 rpm, allowing users to optimize cutting conditions for different materials. The machine’s computerized control system achieves a positioning accuracy of 0.01 mm and a moving resolution of 0.0025 mm, ensuring fine control over cutting paths. The sample stage supports angular adjustments within ±0.5°, enabling angled cuts as required.
Wichtigste Merkmale
- Supports wafers up to 4″ diameter and components up to 8″ L x 4″ W x 1″ H.
- Brushless DC motor with variable speed control up to 3000 rpm and 180W power consumption.
- High precision CNC control with 0.01 mm position accuracy and 0.0025 mm moving resolution.
- Adjustable cutting speeds: X/Y axes 1-50 mm/min, Z axis 1-20 mm/min.
- Sample stage with ±0.5° angle adjustment for angled cutting.
- Includes laptop and software for programmable or manual control of cutting parameters.
- Water cooling system with adjustable nozzles and splash protection for safe operation.
- Complete accessory set including vacuum pump, diamond blade, sample holders, and vacuum chuck with adhesive film.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Spannung | AC 110V or AC 220V ±10% (selectable) |
| Motor Type | Brushless magnetic DC motor |
| Motorleistung | 180 W |
| Maximum Spindle Speed | 3000 rpm (variable) |
| Effective Cutting Range | X-axis: 8″; Y-axis: 4″; Z-axis (depth): 1″ |
| Cutting Speed Range | X/Y axes: 1-50 mm/min adjustable; Z axis: 1-20 mm/min adjustable |
| Position Accuracy | 0,01 mm |
| Moving Resolution | 0.0025 mm |
| Cutting Blade | 4″ diameter x 0.35 mm thick fully sintered diamond blade |
| Blade Flanges | Two pairs: 62 mm diameter (dicing), 42 mm diameter (deep cutting) |
| Software Compatibility | Windows 7/8/8.1/10; manual and programmable control modes |
| Kühlsystem | Water jetting, draining, splash protection; adjustable nozzles; optional coolant circulating tank available separately |
Typische Anwendungsbereiche
The SYJ-400 is suited for precise dicing and cutting of semiconductor wafers such as silicon, germanium, gallium arsenide, quartz, and lithium niobate. It is also applicable for cutting various microelectronic components and research samples requiring high accuracy and clean edges. The system supports thin wafer dicing with vacuum chuck and adhesive film to secure delicate samples.
Hinweise zur Konfiguration und zum Betrieb
The standard package includes a 120L/min oilless vacuum pump, 4″ diamond blade, sample holders, vacuum chuck with adhesive film, cross mount vise, blade clamps of various diameters, stainless steel plate, water splash protection cover, resin ceramic blocks, and wax bars. A laptop with pre-installed control software and USB cable is provided for operation.
Proper use of cutting fluid is essential to prevent corrosion and damage. Oil-based coolants or specialized lubricants like LubeCool-150 are recommended. Tap water must not be used as coolant. Regular blade dressing with the included dressing stone is advised to maintain cutting efficiency, especially when processing sticky materials. After each use, cleaning and lubrication of the lead screw and axes are necessary to ensure smooth operation and prevent rust.
Maße & Versand
| Product dimensions | X-axis: 8″ , Y-axis: 4″, Z-axis: 1″ ( depth) |
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