STX-630B Precision Diamond Wire Saw with 6″x6″x6″ Sample Stage and Protective Enclosure
The STX-630B is engineered for high-precision cutting tasks involving semiconductor wafers and crystalline materials such as silicon (Si), germanium (Ge), and gallium arsenide (GaAs). It accommodates samples up to 150 mm in width, length, and height, enabling efficient slicing of relatively large specimens. The system’s design centers on a stationary sample platform while a diamond-impregnated wire moves vertically to perform the cutting action, ensuring minimal sample movement and enhanced cutting accuracy.
This wire saw integrates a motorized sample stage capable of full 360° rotation and ±10° tilt, allowing precise orientation adjustments to optimize cut angles. The diamond wire, with a diameter range of 0.25 to 0.45 mm and a length of 150 m, is driven by a spindle motor controlled via a PLC system and a 7-inch digital color touchscreen interface. The wire reciprocates backward and forward at speeds adjustable up to 16 m/s, with tension regulated pneumatically between 0.1 and 0.4 MPa to maintain cutting stability. The entire cutting assembly is enclosed within a protective box to prevent environmental contamination and ensure operator safety.
Wichtigste Merkmale
- Diamond wire diameter adjustable between 0.25 mm and 0.45 mm, 150 m length for extended use.
- Motorized sample stage with 360° rotation and ±10° tilt for versatile sample positioning.
- Wire speed adjustable from 0 to 16 m/s for controlled cutting rates.
- Pneumatic wire tension system with adjustable pressure from 0.1 to 0.4 MPa (requires external air compressor).
- PLC controller with 7″ color touchscreen for intuitive operation and precise control.
- Heavy-duty aluminum alloy frame ensuring structural stability and durability.
- Protective enclosure to minimize contamination and enhance safety during operation.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Leistungsaufnahme | Single phase AC 220V, 50/60 Hz, 620 W |
| Spindle Drive Motor | AC 220V, 370 W |
| Wire Moving Speed | 0 to 16 m/s, adjustable |
| Diamond Wire | Diameter 0.25–0.45 mm, Length 150 m |
| Sample Stage Rotation | 0–360°, motorized |
| Sample Stage Tilt | ±10°, motorized |
| Max Sample Size | 150 mm (W) × 150 mm (L) × 150 mm (H) |
| Max Sample Weight | ≤5 kg |
| Wire Tension System | Pneumatic valves, adjustable 0.1–0.4 MPa (air compressor required, not included) |
| Steuergerät | PLC with 7″ digital color touchscreen |
| Frame Material | Heavy-duty aluminum alloy |
| Sample Stage Travel Accuracy | Y-axis: 180 mm ±0.01 mm, Z-axis: 160 mm ±0.01 mm |
Typische Anwendungsbereiche
The STX-630B is ideal for precision cutting of semiconductor wafers, crystalline materials, and other hard brittle samples requiring minimal mechanical stress. It is commonly used in research and development laboratories, semiconductor manufacturing, and materials science for preparing samples for further analysis or device fabrication.
Hinweise zur Konfiguration und zum Betrieb
The standard package includes the main diamond wire saw unit, tension wheels, guide wheels, two rolls of diamond wire, a water pump, wax stick bars, and resin ceramic blocks. Optional accessories include diamond wires of various diameters, dedicated cutting oils, an oil-free silent air compressor, and a desktop X-ray orientation machine.
Proper use of cutting fluids is critical to prevent corrosion and maintain wire sharpness. Oil-based coolants or lubricants mixed with water are recommended; tap water or corrosive fluids must be avoided. For cutting sticky materials, frequent wire dressing using the included dressing stone is advised. The machine should be cleaned thoroughly after each use to ensure longevity and performance.
Maße & Versand
| Product dimensions | & Weight; 780mm L×830mm W×1680mm H |
|---|
