STX-4001 Large Precision Diamond Wire Cutting Saw with 3D Sample Stage and 40″ Diameter Cutting Capacity
The STX-4001 is engineered to meet the demanding requirements of cutting large and delicate crystalline materials such as silicon, calcium fluoride, glass, and sapphire. It accommodates samples up to 1000 mm (40 inches) in diameter, enabling precise slicing without compromising material integrity. This capability is essential for applications requiring smooth, accurate cuts on sizable or fragile specimens.
Cutting is performed using a diamond-impregnated wire with a diameter of 0.28 mm, which moves back and forth under digital control. The system’s 3D sample stage allows movement along the X-axis and rotation in both clockwise and counterclockwise directions, facilitating precise sample orientation during cutting. The saw integrates a pneumatic tensioning system for the wire, ensuring consistent cutting performance.
Wichtigste Merkmale
- Capable of cutting materials up to 40″ (1000 mm) diameter with smooth, precise slicing.
- Diamond wire diameter of 0.28 mm with adjustable tension via built-in pneumatic valves.
- 3D sample stage with X-axis movement and dual-direction rotation for accurate positioning.
- Cutting speed adjustable from 0.05 to 100 mm per minute for process control.
- Wire moving speed variable up to 5 meters per second for optimized cutting efficiency.
- 6″ color LCD touchscreen controller for programming wire speed, feed rate, slice thickness, and coolant operation.
- Integrated circulating water/coolant system with two pumps included to maintain cutting fluid flow.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Stromversorgung | AC 208-240 VAC, 50/60 Hz, 6000 W, Single Phase |
| Cutting Speed | 0.05 – 100 mm/min adjustable |
| Wire Moving Speed | 0 – 5 m/s variable |
| Steuergerät | 6″ color LCD touchscreen for speed, feed, thickness, coolant control |
| Sample Stage | X-axis movement and clockwise/counterclockwise rotation; max load 1500 kg |
| Diamond Wire | Ø 0.28 mm diameter, 400 m length |
| Cutting Area | Ø 1000 mm × 1000 mm |
| Wire Tension | Pneumatic adjustment (requires external air pump >20 PSI, not included) |
| Kühlsystem | Circulating water/coolant with two pumps included |
| Zertifizierung | CE certified; optional UL/CSA inspection available at additional cost |
Typische Anwendungsbereiche
Ideal for slicing large diameter crystals and hard materials used in semiconductor, optics, and materials research. Suitable for cutting silicon wafers, sapphire substrates, calcium fluoride crystals, and glass components requiring high precision and minimal surface damage.
Hinweise zur Konfiguration und zum Betrieb
The saw includes a comprehensive standard package with diamond cutting wire, coolant pumps, wire tensioning wheels, and tools for installation and maintenance. Proper use of cutting fluid is mandatory to prevent corrosion and damage; oil-based coolants or lubricants mixed with water are recommended. Tap water should not be used directly. For cutting sticky materials, frequent wire sharpening using the included dressing stone is advised. Regular cleaning after use is essential to maintain performance and longevity.
