MSK-BSL-H200 Roll-to-Roll Hot Laminator for Tri-Layer Composite
The MSK-BSL-H200 is engineered to facilitate the lamination of tri-layer composite materials using a roll-to-roll process. This equipment is ideal for applications requiring precise thermal bonding of layered substrates, where protection layers safeguard the lamination surfaces during pressing and are removed afterward to ensure clean, high-quality results.
The laminator operates with a combination of a stainless steel roller and a rubber roller, each 120 mm in diameter, providing uniform pressure across a maximum lamination width of 180 mm. The system uses pneumatic actuation powered by compressed air between 0.5 and 0.8 MPa to control lamination pressure up to 0.6 tons. Temperature control is adjustable up to 120°C, enabling optimal bonding conditions for various composite materials.
Wichtigste Merkmale
- Roll-to-roll lamination designed specifically for tri-layer composite materials.
- Adjustable lamination temperature up to 120°C for controlled thermal bonding.
- Pneumatic operation with compressed air supply of 0.5–0.8 MPa for precise pressure control.
- Maximum lamination pressure of 0.6 tons and lamination gap adjustable up to 2 mm with 1 µm resolution.
- Rollers include one stainless steel and one rubber roller, both 120 mm diameter, with a roller width of 200 mm.
- Supports substrate widths less than 180 mm and lamination speeds under 5 meters per minute.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Stromversorgung | AC 208-240 V, 50/60 Hz, Single Phase |
| Stromverbrauch | 3.85 kW |
| Compressed Air | 0.5 – 0.8 MPa for pneumatic operation |
| Rollers | One stainless steel roller (Ø120 mm), one rubber roller (Ø120 mm), roller width 200 mm |
| Laminating Width | Substrate width less than 180 mm |
| Laminating Speed | Less than 5 m/min |
| Lamination Pressure | Maximum 0.6 tons |
| Lamination Gap | Maximum 2 mm, gauge resolution 1 µm |
| Lamination Temperature | Adjustable up to 120°C |
| Winding Roller Diameter | Maximum Ø200 mm, 3″ cardboard core |
| Zertifizierungen | NRTL or CSA certification available upon request (extra cost) |
Typische Anwendungsbereiche
This laminator is suited for research and production environments where tri-layer composite films require precise thermal lamination. It is commonly used in advanced material development, flexible electronics, battery separator fabrication, and other applications demanding controlled pressure and temperature lamination on roll substrates.
Hinweise zur Konfiguration und zum Betrieb
The MSK-BSL-H200 requires a compressed air supply within the specified pressure range for pneumatic operation. Protection layers should be applied to the lamination surfaces during pressing to prevent damage and removed afterward. Optional certifications such as NRTL or CSA can be requested at additional cost. Operators should ensure substrate rolls do not exceed 50 kg and are loaded on 3″ cardboard cores for compatibility with winding rollers.
