UNIPOL-810 Multi-Purpose 8″ Precision Polishing Machine with Fixed Yoke and Complete Diamond Lapping Accessories
The UNIPOL-810 is engineered to meet the demands of precise polishing and lapping tasks for flat and metallographic samples in laboratory environments. It is particularly suited for applications requiring uniform surface finishing without rocking motion, making it unsuitable for wafer polishing but ideal for flat components and metallographic specimens.
This machine integrates an 8-inch diameter super flat aluminum lapping plate driven by a quiet, high torque 0.25 kW DC motor with variable speed control from 0 to 600 RPM. The fixed yoke design ensures consistent polishing action, while the included accessories support both manual and automatic operation modes.
Key Features
- 8″ super flat aluminum lapping plate for high precision surface finishing
- Fixed yoke mechanism enabling automatic polishing without rocking motion
- Variable speed control from 0 to 600 RPM driven by a 0.25 kW high torque DC motor
- Heavy-duty cast aluminum housing with durable painted surface
- Includes multiple sample holders: 75 mm diameter flat holder and 3″ diameter flat holder for various sample sizes
- Complete diamond lapping accessories including 320 and 600 mesh PSA diamond lapping plates and polishing pads
- Plate run-off maintained under 5 microns for consistent polishing quality
Technical Specifications
| Parameter | Specification |
|---|---|
| Power Supply | AC 110V and 208-240V (50/60Hz) switchable |
| Motor | 0.25 kW high torque DC motor |
| Speed Range | 0 – 600 RPM variable speed |
| Lapping Plate Diameter | 8 inches (super flat aluminum) |
| Plate Run-off | Less than 5 microns |
| Sample Holders Included | 75 mm diameter flat holder, 3″ diameter flat holder |
| Housing Material | Heavy-duty cast aluminum with painted surface |
| Compliance | CE Certified; NRTL certification available optionally |
Typical Applications
The UNIPOL-810 is ideal for metallographic sample preparation, precision manual grinding, and polishing of flat components in materials science, metallurgy, and quality control laboratories. It supports simultaneous polishing of multiple small samples using optional holders, enhancing throughput in sample preparation workflows.
Configuration & Operating Notes
Standard package includes the polishing machine, slurry container, condition ring, sample holders, yoke supporter, steel buffer sheet, and polishing pads. Optional accessories such as a 3″ sample holder with three holes and a 2″ polishing fixture are available to expand functionality. The machine’s voltage switch is located at the rear for easy worldwide operation. Note that the fixed yoke design does not provide rocking motion, so it is not suitable for wafer polishing.
