VTC-600-3HD-GB Three-Head Plasma Sputtering Coater Integrated in Glovebox with RF/DC Power Supplies for Multi-Layer Thin Film Deposition
The VTC-600-3HD-GB is engineered to support advanced thin-film deposition tasks, particularly in the research of solid-state lithium batteries and complex multi-layer films. Its integration within a glovebox environment ensures an ultra-low oxygen and moisture atmosphere (below 1 ppm), critical for handling air-sensitive materials and maintaining film integrity during sputtering processes.
This system employs three 2-inch magnetron sputtering heads capable of co-sputtering or sequential layer growth. Two heads are powered by DC sources optimized for metallic targets, while one head uses an RF source suitable for non-conductive materials. The glovebox design facilitates easy sample transfer and handling under controlled atmosphere, enhancing workflow efficiency and sample protection.
Key Features
- Three 2″ magnetron sputtering guns with water cooling and shutters for precise deposition control.
- Dual DC power supplies (500 W each) for metallic coatings and one RF power supply (300 W, 13.56 MHz) for non-conductive films.
- Glovebox integration maintaining oxygen and moisture levels below 1 ppm for sensitive material processing.
- Rotating sample stage (Ø140 mm) with programmable heating up to 500°C and rotation speeds from 1 to 20 rpm.
- Stainless steel vacuum chamber with hinged top flange and glass viewport for easy sample access and observation.
- Mass flow controllers calibrated for nitrogen gas with flow rates up to 200 sccm for precise gas environment control.
- Optional vacuum pumping station and water chiller to support ultra-high vacuum conditions and temperature stability.
Technical Specifications
| Parameter | Specification |
|---|---|
| Power Supply | 208-240 VAC, single phase, 50/60 Hz, 1500 W |
| Glovebox Environment | O2 & H2O < 1 ppm, stainless steel chamber 1200×740×900 mm (L×W×H) |
| Sputtering Heads | Three 2″ magnetron heads with water cooling and shutters; two DC (500 W), one RF (300 W, 13.56 MHz) |
| Target Size | 2″ diameter, thickness 0.1 – 5 mm (optional targets) |
| Vacuum Chamber | Stainless steel, Ø300 × 300 mm H, hinged top flange, 100 mm glass viewport |
| Sample Stage | Ø140 mm rotating, heating up to 500°C, rotation speed 1-20 rpm, programmable temperature controller |
| Gas Flow Control | Two mass flow controllers, nitrogen calibrated, 0-200 sccm flow rate |
| Optional Vacuum Pumping Station | Turbo pumps (63 or 260 L/s), backing pumps (240 L/min rotary vane or 200 L/min dry scroll) |
| Optional Water Chiller | Digital temperature-controlled, 5-35 °C, 16 L/min flow, 14 psi pump pressure |
| Optional Film Thickness Measurement | Quartz crystal microbalance with accuracy up to 1 Å |
Typical Applications
Ideal for research and development of solid-state lithium batteries, thin-film ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, and oxide layers. Supports sequential and co-sputtering processes for complex multi-layer film fabrication under controlled atmosphere.
Configuration & Operating Notes
Sputtering targets are optional and should be selected based on material requirements. For air-sensitive targets or achieving base pressures below 1×10-2 torr, the optional vacuum pumping station is recommended. A water chiller is advised to maintain stable cooling of sputtering heads. Film thickness measurement via quartz crystal microbalance is available as an optional accessory. Proper glovebox handling procedures are essential to maintain low oxygen and moisture levels during operation.
