GSL1100XPJF Compact Atmospheric Plasma Jet-Flow System for Rapid Low-Temperature Surface Treatment Without Vacuum
The GSL1100XPJF is engineered to address the need for efficient surface activation and cleaning in laboratory and industrial environments without requiring vacuum conditions. This system is particularly suited for treating delicate substrates such as single crystal wafers, optical components, plastics, and polymers. By generating a plasma jet flow at atmospheric pressure, it enables rapid surface modification and contamination removal at low temperatures, preserving the integrity of sensitive materials.
The device integrates an RF generator, a flexible gas delivery pipe, and a plasma beam head to produce a stable plasma jet. This plasma beam can be handheld or incorporated into inline processing setups, offering versatility for various surface treatment workflows. The plasma beam head has a diameter of 10-12 mm and maintains a temperature below 60°C during short exposures, requiring continuous scanning to prevent overheating of the sample surface.
주요 기능
- High-speed surface treatment at atmospheric pressure without vacuum or chamber.
- Operates with various gases including air, nitrogen, argon, helium, or mixed gases with 5N purity preferred.
- Compact and lightweight design suitable for handheld or inline use.
- Plasma beam temperature remains below 60°C to protect sensitive materials.
- Input power standard at AC 208-240V, 50/60 Hz with 1000W consumption; AC110V available with optional transformer.
- Output frequency range from 20 to 23 kHz for stable plasma generation.
- Supports dry compressed gases at minimum 40 PSI input pressure and plasma working pressure of 7-10 PSI.
기술 사양
| 매개변수 | 사양 |
|---|---|
| Input Power | AC 208-240V, 50/60 Hz, 1000W (AC110V optional with transformer) |
| Output Frequency | 20-23 kHz |
| Plasma Beam Head Diameter | 10-12 mm |
| Plasma Beam Temperature | Below 60°C (requires scanning to maintain low surface temperature) |
| Input Gas Pressure | Minimum 40 PSI |
| Working Gas Types | Air, N2, Ar, He, or mixed gases (5N purity preferred) |
| Plasma Working Pressure | 7-10 PSI |
| Operating Environment Temperature | Below 42°C |
| Operating Environment Humidity | ≤ 40% RH |
대표적인 적용 분야
The GSL1100XPJF is well suited for cleaning and activating surfaces of plastics, polymers, oxide substrates, and single crystal wafers prior to coating, epitaxial growth, or optical fiber welding. It can also be utilized in atmospheric pressure chemical vapor deposition (CVD) research and development.
구성 및 작동 안내
The system includes one plasma beam head and a flexible gas delivery pipe. For AC110V operation, an additional 1000W transformer must be ordered separately. The plasma beam should be continuously scanned over the sample surface to maintain low temperature and prevent thermal damage. Only dry, non-flammable compressed gases should be used to ensure safe operation. Optional accessories such as automatic scanning systems are available for treating larger surface areas up to 10″ x 10″.
Dimensions & Shipping
| Product dimensions | 380 (W) ×210 (H) ×500 (D) mm |
|---|
