SYJ800 Precision CNC Dicing Saw with Digital Controller, 8″ Wafer Capacity, ±0.01 mm Position Accuracy
The SYJ800 is engineered for high-precision dicing and cutting tasks involving a wide range of materials, including silicon, germanium wafers, and Al2O3 ceramic sheets. It accommodates samples up to 8 inches in diameter or 8″ x 8″ x 1″ in size, making it suitable for electronic substrates and solar panel components. The system’s programmable CNC controller enables accurate positioning within ±0.01 mm across four axes: X, Y, Z, and rotation (R), facilitating complex cutting patterns and angled cuts.
The sample stage features an electric motor-driven rotation with a ±0.5° tolerance, allowing precise angular adjustments up to 180°. Cutting speeds are adjustable across axes, with X and Y ranging from 1 to 50 mm/min and Z from 1 to 20 mm/min. The saw is powered by a 1/2 HP high torque DC motor capable of speeds up to 3000 RPM, supporting dicing depths up to 25 mm with a 4″ blade and up to 50 mm with a 6″ blade.
주요 기능
- Programmable CNC control with 0.0025 mm moving resolution and ±0.01 mm positioning accuracy.
- Supports dicing area of 8″ x 8″ with rotation stage adjustable up to 180° at programmable speeds.
- Includes two diamond blades: 4″ fully sintered and 6″ impregnated, plus water splash guards for each blade.
- Adjustable cutting speeds: X/Y axes 1-50 mm/min, Z axis 1-20 mm/min, rotation up to 120°/min.
- Sample stage equipped with 220 mm diameter glass plate and 8″ vacuum chuck for secure mounting.
- Water cooling system with jetting, draining, and splash protection assemblies included.
- Compatible PC software for setting cutting parameters and manual or programmable operation.
기술 사양
| 매개변수 | 사양 |
|---|---|
| 전압 | AC 220V (AC 110V 50/60Hz with optional 500W transformer) |
| 전력 | 275W |
| Motor | 1/2 HP high torque DC motor, 0 – 3000 RPM |
| Dicing Area | X-axis: 8″, Y-axis: 8″ |
| Dicing Depth | Up to 25 mm with 4″ blade; up to 50 mm with 6″ blade |
| Rotation Range | 180° motorized rotation, speed programmable up to 120°/min |
| Position Accuracy | ±0.01 mm; moving resolution 0.0025 mm |
| Cutting Speed | X/Y: 1-50 mm/min; Z: 1-20 mm/min |
| Included Blades | 4″ fully sintered diamond blade (0.35 mm thick), 6″ impregnated diamond blade (0.5 mm thick) |
| Sample Stage | 220 mm glass plate with 8″ vacuum chuck |
| Software Compatibility | Windows 7/8/8.1; manual and programmable control modes |
대표적인 적용 분야
Ideal for dicing silicon, germanium wafers, and ceramic substrates used in electronics and solar power panel manufacturing. Suitable for cutting sticky materials like non-ferrous alloys, epoxy, and plastics when used with dressing stones to maintain blade sharpness.
구성 및 작동 안내
The standard package includes the CNC controller, vacuum chuck, two water splash guards, wax for sample adhesion, resin bonded ceramics, and blade clamps. Water cooling with jetting and draining assemblies is integrated. Optional extra-thin diamond blades and a coolant circulating tank are available separately. Proper blade dressing is recommended for cutting sticky materials to prevent blade clogging and maintain cutting efficiency.
