VTC-STX-DC Compact 2″ Magnetron Sputtering Coater with Selectable DC or RF Power for Glovebox Integration
The VTC-STX-DC is engineered for precise thin-film deposition on substrates within controlled environments such as argon gloveboxes. It is particularly suited for coating metallic, semiconducting, and nonmetallic materials by offering selectable DC or RF sputtering power sources. This flexibility allows researchers to tailor the sputtering process to the material properties, enhancing film quality and adhesion.
The system features a compact quartz vacuum chamber separated from the power source, enabling safe operation inside gloveboxes. It includes a 2-inch diameter magnetron sputtering head with water cooling jackets, inserted via a quick clamp for easy maintenance. The chamber is sealed with an aluminum flange and high-temperature silicone O-ring, and is equipped with a stainless steel mesh cover to shield RF radiation effectively.
주요 기능
- Selectable 300 W 13.56 MHz RF generator with automatic matching for nonmetallic or semiconducting targets.
- 500 W DC sputtering power source optimized for metallic target coating.
- Single 2″ magnetron sputtering head with water cooling and manual shutter on flange.
- Quartz vacuum chamber (160 mm OD x 150 mm ID x 250 mm height) with aluminum sealing flange.
- Vacuum capability down to 1.0E-2 Torr with included dual-stage mechanical pump; optional turbopump achieves 1.0E-5 Torr.
- Rotatable ceramic heater sample holder (50 mm diameter) with adjustable rotation speed (1-10 rpm) for uniform coatings.
- Includes a copper-backed 2″ copper target (3 mm thick) for demonstration; other targets available optionally.
기술 사양
| 매개변수 | 사양 |
|---|---|
| Input Power | 220 VAC, 50/60 Hz, single phase, 800 W (including pump); 110 VAC requires 1000 W transformer (optional) |
| Power Sources | Selectable 13.56 MHz 300 W RF generator with automatic matching; 500 W DC sputtering power source; both can be ordered |
| Magnetron Sputtering Head | One 2″ head with water cooling jackets, quick clamp insertion, manual shutter on flange |
| Vacuum Chamber | Quartz, 160 mm OD x 150 mm ID x 250 mm height; aluminum flange with silicone O-ring; stainless steel mesh RF shield |
| Vacuum Level | 1.0E-2 Torr with included dual-stage mechanical pump; 1.0E-5 Torr with optional turbopump |
| Sample Holder | Rotatable ceramic heater with stainless steel cover, 50 mm diameter, adjustable 1-10 rpm rotation speed; optional 500°C heating available |
| Sputtering Target | 2″ diameter x 1/4″ thickness max; includes 2″ Cu target (3 mm thick) for demo; optional targets with backing plates available |
| Cooling | Requires 16 L/min digitally controlled recirculation water chiller (sold separately) |
대표적인 적용 분야
Ideal for depositing oxide thin films on oxide single crystal substrates, especially where high vacuum is not mandatory. Suitable for research in materials science, semiconductor device fabrication, and thin-film coatings requiring controlled atmosphere processing.
구성 및 작동 안내
The system requires a vacuum pump with KF25 adaptor (not included). Optional turbopump and 1 ppm gas purification systems can enhance vacuum quality. For glovebox use, a KF40 feedthrough is recommended to connect external power, cooling, and vacuum lines. A precision quartz thickness sensor is available optionally for real-time film thickness monitoring, requiring a laptop for data display.
Substrate cleaning prior to coating is critical for adhesion; ultrasonic cleaning with acetone and isopropyl alcohol followed by nitrogen drying and vacuum baking is advised. Plasma cleaning can be used for additional surface activation. Non-conductive targets should be mounted with copper backing plates for optimal sputtering performance.
