STX-603 Precision Diamond Wire Saw with Adjustable Sample Stage and 6-Inch Diameter Cutting Capacity
The STX-603 is engineered for precision cutting of large-diameter crystalline materials such as silicon, germanium, and gallium arsenide, accommodating samples up to 6 inches (155 mm) in diameter. It is particularly suited for applications requiring smooth, accurate slicing of brittle or hard materials without inducing mechanical stress or damage.
This wire saw operates by moving a diamond-impregnated wire (0.35 mm diameter) back and forth under digital control, enabling fine adjustment of cutting and feed speeds. The sample stage offers multi-axis movement including linear travel and dual-direction rotation, allowing precise orientation of the workpiece for optimal cutting alignment.
Wichtigste Merkmale
- Diamond wire diameter: 0.35 mm, length 80 m, suitable for delicate and precise cutting.
- Cutting feed speed adjustable from 0.01 mm/min to 40 mm/min; back speed adjustable from 1 mm/min to 40 mm/min.
- Sample stage capable of X-axis movement and rotation in clockwise and counterclockwise directions for precise sample positioning.
- Built-in pneumatic wire tension system for consistent cutting performance; requires external air compressor (not included).
- Digital 6-inch color touchscreen controller for intuitive operation and parameter adjustment.
- Heavy-duty aluminum alloy construction ensures stability and durability during operation.
- Maximum sample size supported: 160 mm x 160 mm.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Leistungsaufnahme | AC 220V, 50/60Hz, 350W |
| Structure Material | Heavy-duty Aluminum Alloy |
| Cutting Feed Speed | 0.01 mm/min to 40 mm/min (adjustable) |
| Back Speed | 1 mm/min to 40 mm/min (adjustable) |
| Wire Moving Speed | 0 to 3 m/s |
| Steuergerät | Digital 6-inch Color Touchscreen |
| Diamond Wire | Ø 0.35 mm x 80 m length |
| Z and Y-Axis Travel | 160 mm with ±0.01 mm accuracy |
| Sample Stage Movement | X-axis linear movement and rotation in two directions |
| Maximum Sample Size | 160 mm x 160 mm |
| Wire Tension System | Pneumatic valves (air compressor required, not included) |
Typische Anwendungsbereiche
Ideal for slicing large semiconductor crystals such as silicon, germanium, and gallium arsenide in research and production environments. Also suitable for cutting brittle materials requiring minimal mechanical stress and high precision.
Hinweise zur Konfiguration und zum Betrieb
The saw includes two rolls of diamond wire, tension wheels, guide wheels, sample holders, and various tools such as an allen wrench, spanner, wire installer, and lubricants. Proper cutting fluid must be used to prevent corrosion; oil-based coolants or lubricants mixed with water are recommended. Tap water or corrosive fluids should be avoided. The wire tension is pneumatically controlled and requires an external air compressor, which is not included.
For cutting sticky or non-ferrous materials, frequent sharpening of the diamond wire using the included dressing stone is advised. The machine should be cleaned after each use to maintain performance and longevity.
Maße & Versand
| Product dimensions | & Weight; 640 x 700 x 1450 mm (L x W x H) |
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