VTC-3HD-VP Three-Head RF/DC Plasma Magnetron Sputtering Coater with Integrated 1 PPM Gas Purification System for Powder Coating
The VTC-3HD-VP is engineered to address the challenges of uniformly coating powder materials, particularly for applications such as battery core cell fabrication. This system integrates three 1-inch magnetron sputtering heads within a quartz vacuum chamber, enabling simultaneous multi-source deposition. It supports both DC and RF sputtering power supplies, allowing effective coating of conductive metals and insulating oxides.
A key feature is the vibration sample holder inside the chamber, which agitates the powder to promote even coating coverage by causing the particles to jump and rotate during sputtering. The system also incorporates an advanced gas purification module that replaces traditional turbopumps. This module reduces oxygen and moisture content in the chamber environment to less than 1 part per million, significantly improving film quality and reproducibility.
Wichtigste Merkmale
- Three 1″ magnetron sputtering heads with water cooling jackets and quick clamp installation.
- Integrated DC (500 W) and RF (300 W, 13.56 MHz) power supplies for versatile material coating.
- Adjustable vibration motor speed (400–2000 RPM) with a 2″ powder reservoir for dynamic powder agitation.
- Gas purification system with dual molecular sieve columns, automatic regeneration, and pressure control to maintain O2 and H2O below 1 ppm.
- Quartz vacuum chamber with stainless steel RF shielding and aluminum sealing flange with high-temperature silicone O-ring.
- Adjustable sputtering distance (50–80 mm) and angle (0–25°) for process optimization.
- Included 1″ Cu and Al2O3 sputtering targets with copper backing plates; additional targets and accessories available.
Technische Daten
| Parameter | Spezifikation |
|---|---|
| Eingangsleistung | Single-phase 220 VAC ±10%, 50/60 Hz, 2000 W total (includes vacuum pump and water chiller) |
| Power Sources | DC: 500 W for metals; RF: 300 W at 13.56 MHz for insulators |
| Sputtering Heads | Three 1″ magnetron heads with water cooling and quick clamps |
| Sputtering Targets | 1″ diameter × 1/8″ thickness max; includes Cu and Al2O3 targets |
| Sputtering Distance | Adjustable 50–80 mm |
| Sputtering Angle | Adjustable 0–25° |
| Vacuum Chamber | Quartz, 256 mm OD × 238 mm ID × 276 mm height |
| Maximum Vacuum Level | 1.0 × 10⁻⁵ Torr with turbopump and baking |
| Vibration Sample Holder | Motor speed adjustable 400–2000 RPM; 2″ powder reservoir; suitable for 5–20 ml powder, particle size 1–1000 microns |
| Gas Purification System | Dual molecular sieve columns; automatic regeneration; O2 & H2O < 1 ppm; PLC touch panel control |
Typische Anwendungsbereiche
Ideal for coating powders in battery electrode research, thin film deposition on particulate materials, and development of core cell structures requiring precise multi-material layering.
Hinweise zur Konfiguration und zum Betrieb
Optional quartz film thickness monitors can be installed for real-time coating thickness measurement with 0.10 Å accuracy. The system can be adapted for integration into gloveboxes for air-sensitive materials. Additional sputtering targets, copper backing plates, and RF cables are available as accessories. Proper vacuum drying of powders prior to coating is recommended to ensure optimal film quality.
