GSL1100X-PJF-A Atmospheric Plasma Beam with Automatic 2D Scanning Stage for Uniform Surface Treatment and Low-Temperature Plasma-Enhanced CVD
The GSL1100X-PJF-A is engineered to provide precise and uniform surface treatment by combining an atmospheric plasma beam with an automatic two-dimensional scanning stage. This configuration enables controlled plasma beam movement across the sample surface according to programmable settings, ensuring consistent activation or coating over the entire area. It is particularly suited for delicate materials such as single crystal wafers, optical components, and various plastics, where rapid surface cleaning and activation at low temperatures without vacuum conditions are required.
In addition to surface activation and cleaning, the system supports plasma-enhanced chemical vapor deposition (PECVD) under atmospheric pressure by introducing mixed chemical gases. This allows for thin film growth on substrates at low temperatures, expanding its application range in research and development environments.
Key Features
- Atmospheric plasma beam head with a round nozzle diameter of 10-12 mm for localized treatment.
- Programmable X-Y working stage with step motor drives and manual Z-axis adjustment, enabling scanning over an 8″ x 9″ area.
- Vacuum chuck sample holder (4″ diameter) with included vacuum pump to securely hold wafers up to 6″ diameter.
- RF generator operating at 20-23 kHz frequency with up to 25 kV output for stable plasma generation.
- Compatible with multiple non-flammable gases such as air, nitrogen, argon, and helium at minimum 40 PSI input pressure.
- Control box with LCD display and function keys for setting scanning programs and operating parameters.
- Optional heating plate up to 500°C available upon request for substrate temperature control during processing.
Technical Specifications
| Parameter | Specification |
|---|---|
| Input Power for Plasma | 208 V – 240 VAC, 50/60 Hz, < 1000 W |
| RF Generator Output Frequency | 20-23 kHz |
| Plasma Beam Head Diameter | 10-12 mm (round nozzle) |
| Input Gas Pressure | Minimum 40 PSI (0.055 MPa) |
| Working Gases | Air, N2, Ar, He, or mixed non-flammable gases |
| Plasma Working Pressure | 7-10 PSI |
| Environmental Conditions | Temperature < 42°C, Humidity ≤ 40% RH, No flammable gases |
| Sample Stage Movement | X-Y driven by step motors, Z-axis manual adjustment |
| Maximum Scanning Area | 8″ x 9″ |
| Vacuum Chuck Diameter | 4″ diameter, holds wafers up to 6″ |
| Control Interface | SBC control box with LCD and programmable scanning |
Typical Applications
Ideal for surface activation, cleaning, and modification of sensitive substrates such as single crystal wafers and optical components without vacuum requirements. Also used for atmospheric-pressure plasma-enhanced chemical vapor deposition (AP-PECVD) to deposit thin films at low temperatures.
Configuration & Operating Notes
The system includes the plasma generator, plasma beam head, X-Y scanning stage with vacuum chuck and vacuum pump, and a programmable control box mounted on a mobile cart. Optional accessories include a heating plate capable of reaching 500°C, which requires manufacturer modification and additional cost. The equipment can be operated inside a glovebox or fume hood for controlled atmospheres or hazardous gases. Only non-flammable gases should be used for plasma generation to ensure safety.
Dimensions & Shipping
| Product dimensions | & Net Weight; Coating Stage Dimensions: 560mm L x 483mm W x x 609mm H (Supporting Frame Dimensions: 420mm L x 305mm W x 457mm H); Plasma Generator Dimensions: 406mm L x 508mm W x 230mm H; Movement Control Box Dimensions: 330mm L x 305mm W x 152mm H |
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