UNIPOL802 8-Inch Dual-Station Lapping and Polishing Machine with Touch-Screen Control and Optional Automatic Slurry Feeder
The UNIPOL802 is engineered to facilitate precise surface preparation tasks such as grinding, lapping, and polishing of small samples including crystals, substrates, and wafers with diameters up to 3 inches. It is particularly suited for laboratories requiring controlled and repeatable polishing processes for metallographic and semiconductor sample preparation.
This machine incorporates two independent workstations, each equipped with an 8-inch plate—one cast iron for grinding and one aluminum for polishing. The aluminum plate supports interchangeable magnetic and steel buffer layers, enabling quick changes of polishing media. Operation is managed via a user-friendly touch screen control panel, allowing automated process control and timing.
Key Features
- Two independent 8″ diameter workstations with cast iron and aluminum plates for grinding and polishing.
- Variable master plate speed from 0 to 250 rpm with digital display for precise process control.
- Rocking speed adjustable from 0 to 20 rocking motions per minute on each station.
- Includes flat sample holders for wafers up to 3″ diameter; optional holders available for edge polishing and precision thinning.
- 300 W high torque DC motor ensures consistent performance.
- Optional automatic slurry feeder with a 1-gallon (approx. 3.8 L) capacity for extended polishing runs.
- Switchable power supply supports worldwide operation at AC 110V or 208-240V (50/60Hz).
Technical Specifications
| Parameter | Specification |
|---|---|
| Lapping Plates | Ø8″ cast iron plate for grinding; Ø8″ aluminum plate with interchangeable magnetic and steel buffer layers for polishing |
| Flatness | Less than 2.5 microns per square inch |
| Workstations | Two independent rocking stations |
| Rocking Speed | 0 to 20 rocking motions per minute |
| Sample Holders | Two holders Ø80 × 35 mm for samples up to Ø3″; optional holders for edge polishing, precision thinning, and multi-sample polishing |
| Condition Rings | 95 mm outer diameter × 88 mm inner diameter × 32 mm thickness |
| Master Plate Speed Range | 0 to 250 rpm, variable with digital display |
| Operation Timer | 0 to 99 hours |
| Motor | 300 W high torque DC motor |
| Power Supply | Switchable AC 110V and 208-240V, 50/60 Hz |
| Optional Slurry Feeder | Automatic slurry feeder SKZD-2 with 1.0 gallon (~3.8 L) capacity |
| Certifications | CE certified; NRTL certification available optionally |
Typical Applications
Ideal for metallographic sample preparation, semiconductor wafer polishing, crystal surface finishing, and precision thinning of small substrates. The dual stations allow simultaneous grinding and polishing or parallel processing of different samples.
Configuration and Operating Notes
The standard package includes the UNIPOL802 machine, one cast iron plate, one aluminum plate, two flat sample holders with conditioning rings, and one polymide foam polishing pad. Optional accessories such as specialized sample holders for edge polishing, precision thinning fixtures, and an automatic slurry feeder can be added to enhance functionality. Users should ensure proper mounting of polishing media and sample holders and follow safety guidelines when operating the machine.
