VTC-600-2HD-GB-LD Dual-Head 2″ Magnetron Plasma Sputtering Coater Integrated in Oxygen- and Humidity-Free Glovebox
The VTC-600-2HD-GB-LD is engineered to facilitate high-quality thin film deposition of air-sensitive materials within a rigorously controlled glovebox environment. This system maintains oxygen and humidity levels below 1 ppm, ensuring optimal conditions for coating reactive or delicate films without exposure to ambient atmosphere. It is particularly suited for research and development involving metals, ceramics, semiconductors, and other advanced materials requiring contamination-free processing.
The sputtering coater is integrated into the bottom section of a stainless steel glovebox with a hinged front door for easy sample loading. Two 2″ magnetron sputtering guns are mounted on the top cover, each connected to dedicated power supplies located outside the glovebox. One gun operates with a 500 W DC source optimized for metallic targets, while the other uses a 300 W RF source at 13.56 MHz for non-conductive materials. This dual-head configuration enables sequential or simultaneous deposition of multiple film layers from a wide variety of target materials.
Key Features
- Glovebox environment with automatic purging and regeneration to maintain O2 and H2O below 1 ppm.
- Two 2″ magnetron sputtering heads with water cooling jackets and shutters for precise coating control.
- Integrated dual power supplies: 500 W DC for metals and 300 W RF (13.56 MHz) for non-metallic films.
- Rotatable and heatable ceramic sample stage with copper cover, supporting up to 4″ wafers, adjustable rotation speed (1–20 rpm), and temperature control up to 500 °C.
- Vacuum chamber of 300 mm diameter and 300 mm height with hinged lid and viewport for observation and easy target replacement.
- Two precision mass flow controllers for dual gas inlet with adjustable flow rates, requiring high purity argon gas.
- Included 240 L/min double stage rotary vacuum pump with exhaust filter and digital temperature-controlled recirculating water chiller.
Technical Specifications
| Parameter | Specification |
|---|---|
| Glovebox Chamber Dimensions | 1200 mm L x 740 mm W x 900 mm H, stainless steel |
| Vacuum Chamber Size | 300 mm diameter x 300 mm height, stainless steel |
| Sputtering Targets | Two 2″ diameter targets, thickness 0.1–5 mm (including backing plate) |
| Power Supplies | One DC 500 W for metallic targets; one RF 300 W, 13.56 MHz for non-metallic targets |
| Sample Stage | Rotatable (1–20 rpm), heatable up to 500 °C (±1 °C accuracy), 140 mm diameter |
| Gas Flow Control | Two mass flow controllers: 0–200 mL/min and 0–100 mL/min; requires 5N purity Ar gas |
| Vacuum Pump | 240 L/min double stage rotary pump with exhaust filter |
| Water Chiller | Digital temperature control, 5–35 °C range, 16 L/min flow rate |
| Power Supply | Single-phase 220 VAC, 50/60 Hz, total 2500 W including pump and chiller |
Typical Applications
This system is ideal for depositing thin films of metals, alloys, ferroelectric materials, semiconductors, ceramics, dielectrics, optical coatings, and PTFE in an inert, moisture-free atmosphere. It supports research requiring multilayer coatings and precise control over film composition and thickness, particularly for air-sensitive or reactive materials.
Configuration & Operating Notes
The system includes one stainless steel and one research-grade Al2O3 target for demonstration. Optional accessories include a quartz film thickness monitor with 0.10 Å accuracy for in-situ thickness measurement. The glovebox purification system features automatic purging and regeneration to maintain ultra-low oxygen and moisture levels. Users should supply 5N purity argon gas for sputtering operations. Safety precautions include proper handling of vacuum and high-voltage components and adherence to glovebox operational protocols.
