VTC-16-SM High Power Desktop Magnetron Sputtering Coater with Rotary Stage and Water Chiller for Metallic Film Deposition up to 4″ Diameter
The VTC-16-SM is engineered for laboratory-scale deposition of metallic thin films on substrates up to 4 inches in diameter. It is particularly suited for coating metals such as zinc, aluminum, titanium, copper, and carbon-based light films. This system integrates a desktop magnetron sputtering unit with a water-cooled 2-inch target head and a rotatable sample holder to ensure uniform film thickness and high-quality coatings.
The coater includes a quartz glass specimen chamber with dimensions of 165 mm outer diameter, 150 mm inner diameter, and 250 mm height. The 50 mm diameter stainless steel sample stage rotates between 0 and 5 RPM, allowing for even deposition. The distance between the sputtering head and the sample stage is adjustable from 60 to 100 mm to optimize coating conditions. A water chiller with a 10 L/min flow rate is provided to maintain stable cooling of the sputtering head during operation.
Key Features
- High power DC magnetron sputtering with up to 250 W output and 1600 VDC voltage.
- Water-cooled 2″ magnetron sputtering head compatible with targets up to 1/4″ thickness (non-magnetic) or 1/16″ (magnetic).
- Rotatable 50 mm stainless steel sample stage with speed control from 0 to 5 RPM for uniform coating.
- Quartz glass specimen chamber providing a controlled vacuum environment.
- Integrated 6″ color touch-screen panel with PLC for monitoring and controlling vacuum and current parameters.
- Includes one 2″ copper target (2.5 mm thick) for immediate testing; supports various metallic targets including Ag, Al, Cr, Ni, Pt, Ti, Sn, Li, Mg.
- Built-in overcurrent protection to safeguard the system at currents above 150 mA.
- Air-cooled recirculating water chiller ensures stable temperature control of the sputtering head.
Technical Specifications
| Parameter | Specification |
|---|---|
| Input Voltage | 220 VAC, 50/60 Hz (110 V via optional 1000 W transformer) |
| Output Power | Up to 250 W DC, 1600 VDC, max 150 mA |
| Specimen Chamber | Quartz glass tube, 165 mm OD × 150 mm ID × 250 mm height |
| Sputtering Head | 2″ flexible magnetron with water cooling; target thickness up to 1/4″ (non-magnetic), 1/16″ (magnetic) |
| Sample Stage | 50 mm diameter stainless steel, rotatable 0–5 RPM |
| Distance Adjustment | Sputtering head to sample stage adjustable from 60 to 100 mm |
| Cooling System | Air cold recirculating water chiller, 10 L/min flow |
| Control Panel | 6″ color touch-screen with PLC integration for vacuum and current control |
| Vacuum Port | Built-in KF25 vacuum port; vacuum pump not included |
| Included Target | One 2″ diameter copper target, 2.5 mm thick |
Typical Applications
This sputtering coater is ideal for depositing thin metallic films in research and development laboratories, especially for semiconductor wafers, optical coatings, and surface modification of materials. It supports coating of various metals including copper, aluminum, titanium, zinc, and carbon films for electronics, optics, and material science applications.
Configuration & Operating Notes
The system requires an external argon gas supply with a pressure regulator (not included) for plasma generation. Vacuum pumps are sold separately; a vane pump can achieve base pressures below 5×10-2 Torr suitable for less air-sensitive metals, while a turbomolecular pump is recommended for more sensitive targets requiring pressures below 1×10-4 Torr. Overnight pumping and baking can further reduce vacuum to below 4×10-6 Torr.
Optional accessories include a film thickness monitor, heatable sample stage up to 500°C, and a flowmeter for precise gas control. Operators must observe safety precautions due to high voltage at the sputtering head and should wear gloves during operation. Proper cleaning of targets and substrates before coating is essential for consistent film quality.
