GSL-1100X-XX-III Three-Zone Tube Furnace with 8.5″ or 11″ OD Quartz Tube and Hermetic Stainless Steel Flanges
The GSL-1100X-XX-III tube furnace is engineered for advanced wafer processing applications requiring precise thermal management. It incorporates a three-zone heating system, each zone measuring 300 mm, to provide a total heating length of 900 mm. This configuration allows for controlled temperature gradients and uniform heating essential for processes such as annealing and diffusion.
The furnace accommodates quartz tubes with outer diameters of either 8.5″ or 11″, both 1300 mm in length, and features hermetic stainless steel flanges designed for vacuum compatibility. The system supports continuous operation at temperatures up to 1100°C, with short-term capability up to 1200°C. Temperature control is managed via three PID controllers, enabling programmable temperature segments and maintaining accuracy within ±1°C.
Key Features
- Three independent heating zones of 300 mm each for precise temperature profiling.
- Choice of 8.5″ or 11″ outer diameter quartz tubes, 1300 mm length, suitable for wafer boats up to 6″ or 8″ respectively.
- Hermetic stainless steel flanges with water cooling and vacuum sealing, including KF40 vacuum ports and gas inlet valves.
- PID programmable temperature controllers with 30 segments and ±1°C control accuracy.
- Operating temperature up to 1100°C continuously, with maximum heating and cooling rates of 10°C/min.
- Double-layer steel casing with air cooling to maintain surface temperature below 70°C.
- Optional quartz baffle blocks for enhanced wafer annealing and diffusion uniformity.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | GSL-1100X-8.5-III or GSL-1100X-11-III |
| Quartz Tube Dimensions | 8.5″ O.D x 8.1″ I.D x 1300 mm L or 11″ O.D x 10.6″ I.D x 1300 mm L |
| Heating Length | 900 mm total (3 zones of 300 mm each) |
| Uniform Heating Length | 600 mm ±3°C at 800°C |
| Maximum Operating Temperature | 1100°C continuous, 1200°C for ≤1 hour |
| Temperature Control | Three PID controllers, 30 programmable segments, ±1°C accuracy |
| Thermocouples | Dual K-type per zone |
| Power Supply | 208-240 VAC single-phase 50/60 Hz, 40 A; three-phase options available |
| Flanges | Water-cooled stainless steel hermetic flanges with vacuum gauge, needle valves, KF40 vacuum port, and gas inlet |
| Vacuum Capability | < 5e-2 torr with mechanical pump; turbo pump connection optional |
| Cooling Water Requirements | 5-30°C distilled water, >16 L/min flow, <80 psig pressure |
Typical Applications
This tube furnace is ideal for semiconductor wafer annealing, diffusion processes, thin film deposition, and other high-temperature material treatments requiring uniform thermal profiles and vacuum compatibility.
Configuration & Operating Notes
Optional quartz boats are available to accommodate wafers up to 6″ or 8″ depending on tube size. Quartz baffle blocks can be added to improve gas flow and temperature uniformity during annealing. The furnace includes hinged vacuum sealing assemblies and O-rings for flange sealing. Users should ensure proper water cooling and vacuum system connections for safe and efficient operation. LabVIEW-based temperature control software is optionally available for advanced recipe management and data logging.
